Elementary, Mr. Watson: Design Data Packages—Circle of Concern or Circle of Influence?
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The Shaughnessy Report: Solving the Data Package Puzzle
Real Time with... IPC APEX EXPO: New Book on Stackup Design
January 26, 2022 | Real Time with...IPCEstimated reading time: Less than a minute
Your stackup is basically the heart of your design. Now, there's a great new eBook that answers all of your questions about designing the perfect stackup: "The Printed Circuit Designer's Guide to... Stackup Design," written by Bill Hargin of Z-zero.
In this IPC APEX EXPO interview, Happy Holden speaks with Bill about the importance of this topic and what readers can learn in his new book. Look for it in the I-007eBooks library.
Watch this interview below, or click here to view on our show page. If you didn't make it to IPC APEX EXPO, don't worry. We're bringing you coverage of the week's events, from ribbon cutting to teardown. Check out all of our interviews at Real Time With... IPC APEX EXPO.
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