Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
Connect the Dots: How to Avoid Five Common Causes of Board Failure
Real Time with... IPC APEX EXPO: New Book on Stackup Design
January 26, 2022 | Real Time with...IPCEstimated reading time: Less than a minute
Your stackup is basically the heart of your design. Now, there's a great new eBook that answers all of your questions about designing the perfect stackup: "The Printed Circuit Designer's Guide to... Stackup Design," written by Bill Hargin of Z-zero.
In this IPC APEX EXPO interview, Happy Holden speaks with Bill about the importance of this topic and what readers can learn in his new book. Look for it in the I-007eBooks library.
Watch this interview below, or click here to view on our show page. If you didn't make it to IPC APEX EXPO, don't worry. We're bringing you coverage of the week's events, from ribbon cutting to teardown. Check out all of our interviews at Real Time With... IPC APEX EXPO.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.
The Shaughnessy Report: Winning the Signal Integrity Battle
09/09/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportWhen I first started covering this industry in 1999, signal integrity was the hip new thing in PCB design. Conference classes on signal integrity were packed to the walls, and an SI article was guaranteed to get a lot of reads.
The Signal Integrity Issue: Design007 Magazine September 2025
09/09/2025 | I-Connect007 Editorial TeamAs the saying goes, “If you don’t have signal integrity problems now, you will eventually.” This month, our experts share a variety of design techniques that can help PCB designers and design engineers achieve signal integrity.