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AMD and Fujitsu to Begin Strategic Partnership to Accelerate Open-Source AI Initiatives

11/01/2024 | AMD
AMD and Fujitsu Limited today announced that they have signed a memorandum of understanding (MOU) to form a strategic partnership to create computing platforms for AI and high-performance computing (HPC). The partnership, encompassing aspects from technology development to commercialization, will seek to facilitate the creation of open source and energy efficient platforms comprised of advanced processors with superior power performance and highly flexible AI/HPC software and aims to accelerate open-source AI and/or HPC initiatives.

Biden-Harris Administration to Invest $825 Million in First CHIPS for America R&D Facility

11/01/2024 | U.S. Department of Commerce
The Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the first CHIPS for America research and development (R&D) flagship facility. The CHIPS for America Extreme Ultraviolet (EUV) Accelerator, an NSTC facility (EUV Accelerator), is expected to operate within NY CREATES’ Albany NanoTech Complex in Albany, New York, supported by a proposed federal investment of an estimated $825 million. The EUV Accelerator will focus on advancing state of the art EUV technology and the R&D that relies on it.

CACI Completes Acquisition of Azure Summit Technology

10/31/2024 | BUSINESS WIRE
CACI International Inc. announced that it has completed its acquisition of Azure Summit Technology, a provider of innovative, high-performance radio frequency (RF) technology and engineering, focused on electromagnetic spectrum, in an all-cash transaction for $1.275 billion.

Biden-Harris Administration Designates Albany NanoTech as First CHIPS for America R&D Flagship

10/31/2024 | U.S. Department of Commerce
The Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the first CHIPS for America research and development (R&D) flagship facility.

DuPont, Zhen Ding Technology Group Sign Strategic Cooperation Agreement to Advance High-End PCB Technology Development

10/30/2024 | DuPont
DuPont and Zhen Ding Technology Group announced they have entered into a strategic cooperation agreement in advanced printed circuit board (PCBs) technology.
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