SMT Perspectives and Prospects: Warren Buffett’s Perpetual Wisdom, Part 1
Standard of Excellence: Training Your Team to Excel in Customer Service
Smart Automation: What Industry 4.0 Means for Mid-sized Electronics Manufacturing
Information from Mycronic’s Nomination Committee
February 11, 2022 | MycronicEstimated reading time: 1 minute
The Nomination Committee of Mycronic AB proposes ahead of the Annual General Meeting on May 5, 2022, the re-election of Patrik Tigerschiöld, Arun Bansal, Anna Belfrage, Katarina Bonde, Staffan Dahlström and Robert Larsson and the election of Bo Risberg to the company’s Board. The Nomination Committee furthermore proposes the re-election of Patrik Tigerschiöld as Chairman of the Board.
Bo Risberg has long and extensive industrial experience, including 14 years at Hilti Corporation, of which 6 years as COO and 7 years as CEO. Furthermore, Bo has 14 years’ experience from various roles within ABB. Since 2013, Bo Risberg is inter alia industrial advisor to EQT AB and Board member. Today he is Chairman of Dellner Couplers AB, Ellab A/S in Denmark and Board member of Stäubli International AG in Switzerland.
Mycronic’s Nomination Committee comprises Henrik Blomquist, appointed by Bure Equity AB, Thomas Ehlin, appointed by The Fourth Swedish National Pension Fund, Patrik Jönsson, appointed by SEB Fonder and Patrik Tigerschiöld, Chairman of the Board. The Nomination Committee has been appointed in accordance with the instruction adopted at the Annual General Meeting in Mycronic AB on May 5, 2021 and represented 46.9 percent of votes and shares as of 31 August, 2021.
The Nomination Committee’s other proposals will be announced in the notice to the Annual General Meeting.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Solving the Toughest BGA Challenges in Electronics
07/30/2025 | Nash Bell, BEST Inc.Since the late 1990s, ball grid array (BGA) packages have emerged as a preferred package style for electronic devices. Compared with high-density ultra-fine pitch quad flat packs (QFPs), BGA packages significantly reduce the required footprint on printed circuit boards (PCBs) by approximately 50%.
Reciprocal Tariffs and Talent Bottlenecks are Driving Changes in PCB Investment in Southeast Asia
07/30/2025 | TPCAAs the global supply chain continues to restructure, Southeast Asia, leveraging its geographical advantages and favorable policies, has become a strategic hub for global circuit board manufacturing.
Target Condition: The 5 Ws of PCB Design Constraints
07/29/2025 | Kelly Dack -- Column: Target ConditionHave you ever sat down to define PCB design constraints and found yourself staring at a settings window with more checkboxes than a tax form? You’re not alone. For many designers—especially those newer to the layout world—the task of setting up design constraints can feel like trying to write a novel in a language you just started learning.
From Attraction to Action: Where Marketing Ends and Sales Begins
07/29/2025 | Brittany Martin, I-Connect007Before a PO hits the system, marketing has already done a lot of heavy lifting. Without strategic marketing, the PO might never arrive. At I-Connect007, we have been fortunate to help many companies achieve sales success through marketing. The key to success? Understanding how marketing leads to sales.
Calumet Electronics Continues to Advance Domestic HDI Circuit Board and Organic Substrate Capability
07/25/2025 | Calumet ElectronicsCalumet Electronics Corporation, a leading American-made printed circuit board (PCB) manufacturer, today announces another major milestone in its ambitious program to bring advanced high-density interconnect (HDI) and high-density buildup (HDBU) capabilities online.