Target Condition: Are Autorouters Friend or Foe?
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
Elementary Mr. Watson: Retro Routers vs. Modern Boards—The Silent Struggle on Your Screen
Four Industry Rising Stars Recognized at IPC APEX EXPO 2022
February 14, 2022 | IPCEstimated reading time: 1 minute
In recognition of their leadership roles and support of IPC standards, education, advocacy, and solutions to industry challenges, four of the industry’s best and brightest were presented with an IPC Rising Star Award at IPC APEX EXPO 2022. Award recipients were Tim Burke, Francisco Fourcade, Thomas Marktscheffel, and Christina Rutherford.
Burke, CTO and co-founder, Arch Systems, was honored for his active membership on the IPC-CFX committee A-team, advancing the ability of factories to collect and analyze machine data using “big data” and machine learning techniques. Burke works on implementing CFX in the field, helping to develop equipment for manufacturing facilities.
Fourcade, a master IPC trainer, was honored for his integral role in several IPC standards development committee A-Teams. A participant in the J-STD-001 A-Team, IPC-A-610 A-Team, Shock and Awe A-Team, Team Kangaroo, Team Iron, Team Bones, and the IPC/WHMA-A-620 Training Committee A-Team, his commitment enabled all teams to fully participate in discussions.
Marktscheffel, a product manager at ASM Assembly Systems, Germany, was honored for his expertise in smart factory implementation, supporting global industry standards such as IPC-CFX and HERMES to provide plug and play connectivity for SMT smart factories. Marktscheffel currently serves on 13 IPC standards development committees.
Rutherford, a materials and process engineer at Honeywell Aerospace, was honored for her leadership of Team Bones, a sub-team developing X-ray guidelines for IPC/WHMA-A-620 for cable and harness. Rutherford, a third-year IPC emerging engineer, serves as a member of the IPC-A-610 A-Team committee, is an IPC scholarship reviewer, and was recently named vice-chair of the 5-24G Polymerics Standard Task Group developing IPC-5262, Design, Critical Process and Acceptance Requirements for Polymeric Applications.
“The leadership shown by our Rising Star recipients has made a significant impact on IPC and will do so for years to come,” said John W. Mitchell, IPC president and CEO. “We are privileged that Tim, Francisco, Thomas and Christina have chosen to share their knowledge and expertise with us and with the entire global electronics manufacturing industry.”
Share on:
Suggested Items
S&K Aerospace Awarded Major Contract Under DLA Maritime Acquisition Advancement Program
07/02/2025 | BUSINESS WIRES&K Aerospace, LLC has been awarded a significant contract under the Defense Logistics Agency’s (DLA) Maritime Acquisition Advancement Program, managed by the U.S. Naval Supply Command - Weapon Systems Support (NAVSUP WSS) in Mechanicsburg, PA.
Green Circuits to Exhibit Full-Service Electronics Manufacturing Solutions at 2025 SMD Symposium
07/02/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce its participation in the 2025 SMD Symposium, taking place August 5-7 at the Von Braun Center in Huntsville, Alabama.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
RTX, the Singapore Economic Development Board Sign MOU Outlining 10-year Growth Roadmap
06/20/2025 | RTXRTX and the Singapore Economic Development Board (EDB) have signed a Memorandum of Understanding (MoU) which outlines a 10-year roadmap to further long-term strategic collaboration in Singapore.