L3Harris Completes Imager Integration for NOAA’s Advanced Environmental Satellite
February 21, 2022 | Business WireEstimated reading time: Less than a minute

The fourth Advanced Baseline Imager (ABI) built by L3Harris Technologies has been successfully integrated into NOAA’s Geostationary Operational Environmental Satellite-U (GOES-U), completing the series of advanced weather sensors for the GOES program, slated to launch in 2024.
The ABIs onboard the GOES series of satellites provide revolutionary technology by advancing weather observation and environmental monitoring services, and also by providing more advanced notice of fires, hurricanes, tornadoes and floods. The ABI provides high-resolution video of weather and environmental systems using 16 spectral bands delivering three times the amount of spectral coverage, four times the resolution and five times faster than the previous generation of GOES satellites.
For nearly 60 years, L3Harris has developed breakthrough technology and launched innovative solutions that further improve the accuracy of weather forecasts, measure climate change and increase life-saving warning times.
The third ABI is onboard NOAA’s GOES-T satellite, scheduled to launch March 1, 2022. GOES satellites are under command and control of the L3Harris-built enterprise ground system.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Advint and Sayron Bring Advanced Rectifier Solutions to High-Reliability PCB Manufacturers
08/01/2025 | Advint IncorporatedAdvint Incorporated has partnered with Sayron, a leading global rectifier manufacturer, to supply cutting-edge IGBT-based DC rectifiers to high-performance PCB manufacturers across North America and beyond. Sayron’s precision-engineered rectifiers align with the stringent requirements of advanced PCB processes.
LQDX Inc. Completes Sale of Aluminum Clad Laminate IP to Toyo Aluminium K.K.
07/31/2025 | PR NewswireLQDX, formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, today announced that it has completed the divestiture of its Aluminum Clad Laminate IP – known as ACL™ – to Toyo Aluminium K.K., a Japan-based global market leader in specialty aluminum-based products for the consumer, electronics and automotive sectors.
Global Dry Film Photoresist Market Set for Robust Growth with Expanding Semiconductor Ecosystem
06/24/2025 | PRNewswireIn 2024, the global market size of Dry Film Photoresist was estimated to be worth US$939 million and is forecast to reach approximately US$1191 million by 2031 with a CAGR of 3.5% during the forecast period 2025-2031.
Benchmark Strengthens Presence in Jalisco with Grand Opening of Advanced Manufacturing Facility in Guadalajara
06/21/2025 | BUSINESS WIREBenchmark Electronics, Inc., a global provider of engineering, design, and manufacturing services, celebrated the grand opening of its brand-new manufacturing facility in Guadalajara, Mexico.
NHanced Semiconductors VP Charles Woychik to Deliver Keynote at SMTA’s Symposium on Counterfeit Parts & Materials
06/18/2025 | NHanced SemiconductorsAt the upcoming SMTA Symposium on Counterfeit Parts & Materials, NHanced Semiconductors vice-president Dr. Charles Woychik will deliver a keynote address detailing the critical role of advanced packaging technologies needed to build a more resilient and advanced Outsourced Assembly and Test (OSAT) sector in the U.S. A strategic focus on advanced packaging technologies.