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Surfx Technologies Leaves No Excuse to Skip Plasma Surface Preparation for Critical Processes
February 25, 2022 | Surfx Technologies, LLCEstimated reading time: Less than a minute

Surfx Technologies, LLC, the most trusted name in atmospheric plasma, is pleased to offer its STA-10iL Automated Plasma Machine designed for high-volume manufacturing. The STA-10iL offers a slim footprint, fast lead times and flexible configurations, leaving no excuse to skip plasma surface preparation for critical processes.
Inside the STA-10iL, a three-axis gantry selectively applies the most advanced atmospheric plasma to substrates. Surfx’s Atomflo™ controller operates with low voltage, radio frequency (RF) power, and generates a uniform, particle-free and electrically neutral plasma that is safe on the most sensitive electronics.
Surfx Technologies’ versatile conveyor design allows for rapid surface preparation of electronics, including all types of IC packages. Whether for cleaning dies, silicon wafers, medical devices or molded plastic parts, the STA-10iL easily can be configured for any job with a working volume of 550 x 760 x 60 mm.
Surfx argon plasma systems clean and activate a wide variety of material surfaces, including glass, ceramics, polymers, semiconductors and metals.
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Rachael Temple - AlltematedSuggested Items
Designers Notebook: Basic PCB Planning Criteria—Establishing Design Constraints
07/22/2025 | Vern Solberg -- Column: Designer's NotebookPrinted circuit board development flows more smoothly when all critical issues are predefined and understood from the start. As a basic planning strategy, the designer must first consider the product performance criteria, then determine the specific industry standards or specifications that the product must meet. Planning also includes a review of all significant issues that may affect the product’s manufacture, performance, reliability, overall quality, and safety.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
STMicroelectronics, Metalenz Sign a New License Agreement to Accelerate Metasurface Optics Adoption
07/14/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and Metalenz, the pioneer of metasurface optics, announced a new license agreement.
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
Global PCB Connections: Embedded Components—The Future of High-performance PCB Design
06/19/2025 | Jerome Larez -- Column: Global PCB ConnectionsA promising advancement in this space is the integration of embedded components directly within the PCB substrate. Embedded components—such as resistors, capacitors, and even semiconductors—can be placed within the internal layers of the PCB rather than mounted on the surface. This enables designers to maximize available real estate and improve performance, reliability, and manufacturability.