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White Paper: Optimization Methods for High-Speed SerDes Channels
March 24, 2022 | Siemens Digital IndustriesEstimated reading time: Less than a minute

Cost-effective implementation of these high-bandwidth channels across high-volume manufactured products requires analysis of many design and manufacturing parameters.
This Siemens white paper presents a new approach for the systematic analysis of SerDes channel compliance at 25Gbps and above. Using a 100GBASE-KR4 electrical backplane design, the methodology reveals the system's sensitivity to various design variables, intelligently explores the design space, and provides a high-level description of the automation involved in the analysis process. Demand for higher bandwidth has greatly increased the signaling data rates for SerDes.
To download this Siemens white paper, click here.
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Sweeney Ng - CEE PCBSuggested Items
Si2 Names NVIDIA, Synopsys Technologists to Lead New LLM Benchmarking Coalition
10/10/2025 | BUSINESS WIREThe Silicon Integration Initiative today announced the chair and vice chair of the Si2 Large Language Model Benchmarking Coalition (LBC), a collaborative industry initiative and standards body advancing AI for silicon design and verification that will expedite the development of high-quality large language models for semiconductor design problems.
Quilter Secures $25M Series B to Eliminate Manual PCB Design with Physics-Driven AI
10/09/2025 | BUSINESS WIREQuilter, the first and only company to publicly demonstrate fully autonomous PCB layout through physics-driven AI, announced $25 million in Series B funding led by Index Ventures.
The Shaughnessy Report: Watt About Power Integrity?
10/08/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportYes, that headline is the equivalent of a dad joke, but editors can’t pass up a chance to inject a little humor into a headline, and I had to take my shot. Power integrity (PI) problems are no joke. Current power demands are increasing, especially with AI, 5G, and EV chips, which can lead to voltage drops that kill your performance.
Taking Control of PCB Verification One Step at a Time
10/09/2025 | Kirk Fabbri, Siemens EDAToday’s designs are as complex as ever, and engineers face tough decisions every day. Simulation and verification teams are confronted with a three-fold challenge: understanding the underlying theory, mastering the tools, and applying best practices.Engineers need to navigate a vast and ever-changing cast of design and simulation tools, often with overlapping functionality.
ICT Symposium Review: Sustainability and the Circular Economy
10/09/2025 | Pete Starkey, I-Connect007It was pleasant autumnal weather as we made our way once again to Meriden, the nominal centre of England, for the 2025 Annual Symposium of the Institute of Circuit Technology. Delegates were welcomed by technical director Emma Hudson who introduced and moderated a skilfully coordinated programme, focused on the highly relevant theme of sustainability.