-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Rehm Presents Vacuum Technologies at SMART SMT & PCB Assembly in Korea
April 4, 2022 | Rehm Thermal SystemsEstimated reading time: 1 minute

From 6 - 8 April 2022, Rehm will be represented at one of the most important Korean trade fairs at the Suwon Convention Centre and will present the latest equipment and system technology from the fields of reflow soldering with convection and condensation in combination with vacuum processes.
Smart SMT & PCB Assembly (SSPA) takes place at the Suwon Convention Center, a central location for the electronics industry. With 200 exhibitors and around 12,000 visitors, it is one of the most important trade fairs in Korea for electronics manufacturing. In addition to numerous exhibitors from the fields of SMT manufacturing, semiconductor equipment, automation solutions for production and software, visitors can expect a conference programme with expert presentations on the latest trends in electronics manufacturing. At stand E110 on 1st floor, we will present the VisonXP+ VAC reflow convection soldering system and the CondensoXC vapour phase soldering system. Our team on site will be happy to advise you and looks forward to seeing you!
VisionXP+ VAC: The innovative system for reflow convection soldering with vacuum module is now even more efficient! At NEPCON Korea, Rehm will present the highlights of the VisionXP+, e.g. the use of new EC fan motors, which are not only quieter and more sustainable, but also enable comprehensive operating data recording, a more powerful cooling section and optimisations in the design. The vacuum module ensures void-free soldering and thus reliable assemblies for the most demanding applications.
CondensoXC: The CondensoXC vapour phase soldering system is compact in design and large in performance thanks to the innovative process chamber. The patented injection principle feeds exactly the right amount of Galden® into the process for optimum profiling. Almost 100 % of the medium can be recovered and filtered via the closed-loop filter system. The system is fully vacuum-compatible and has an integrated process recorder - for optimal traceability.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs
10/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.
NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
10/13/2025 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center, Hillsboro. The event brings together engineers, product designers, manufacturers, educators, and community partners for a full day of industry connection, learning, and networking.
Critical Minerals: The New Power Play in Global Trade
10/13/2025 | Marcy LaRont, I-Connect007Access to critical minerals essential for electronics manufacturing, and China’s monopoly of them, is increasingly under scrutiny, with gallium (Ga) and germanium (Ge)at the forefront of this discourse. However, all critical minerals imported from China share a similar narrative, and understanding the implications of this dependency and the risks to both U.S. commercial and defense sectors has created an urgent need for a comprehensive electronics strategy to secure and diversify access to these vital minerals. In this candid interview, USPAE Executive Director Jim Will discusses the issues and the mitigation steps that must be taken to adequately address them.
Precision PCB Acquires Assets of Microplace
10/13/2025 | Precision Technologies Inc.Precision Technologies Inc., doing business as Precision PCB, a One-Stop PCB Fabrication and Assembly services company with 27 years of experience providing Quality, Reliability and Excellence in customer service, has acquired the assets of Microplace, Inc.