Material Application for Mini Backlight Unit

Estimated reading time: 1 minute

In 1980, about 90% of the materials used to make PCBs was FR-4. As time went by, technology developed, and electronic devices relentlessly integrated into every area of our lives. The constant acceleration of upgrading meant endless challenges and opportunities for CCL suppliers. Wazam New Material Co. Ltd. is a CCL supplier that strives to be attentive to the needs of its end customers and provide comprehensive solutions. 

One example is the MBLU application material. Since 2021, mini LED backlight has become the focus direction of mainstream technology improvements. As the size of chips and optical distance has become increasingly smaller, the assurance of a product’s reliability has put an even stricter demand on the reliability of the whole supply chain.  

A deviation that was acceptable before has become intolerable. As seen in Figure 1, with the same deviation, the effective soldering area has reduced from 50% to only 5%. To improve the performance rate and the effectiveness of the LED Die Bonder, PCBs must have products with sizes that are more stable. 

The traditional FR-4 material’s thermal expansion rate is around 0.04%. As we brought in the polyimide resin, the heat resistence and size stability has been improved. Together with carefully selecting the filler materials and readjusting the proportion, Wazam was able to reduce the material’s thermal expansion rate to about 0.015%.  

To read this entire article, which appeared in the March 2022 issue of PCB007 Magazine, click here.