-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Stellantis, Qualcomm Collaborate to Power New Vehicle Platforms with Snapdragon Digital Chassis Solutions
April 14, 2022 | Qualcomm Technologies, Inc.Estimated reading time: 2 minutes
Stellantis N.V. and Qualcomm Technologies, Inc. announced a multi-year technology collaboration to utilize the latest Snapdragon Digital Chassis advancements to deliver intelligent, customizable and immersive in-vehicle experiences to millions of vehicles across Stellantis’ 14 iconic automotive brands beginning in 2024. Leveraging the Snapdragon® Cockpit Platforms and 5G capabilities for telematics systems, Stellantis will have the capability to meet customers’ evolving expectations for personalized and cutting-edge experiences that are continually upgradeable.
This agreement will facilitate Stellantis’ plan to merge all software domains into High Performance Computers, leveraging the high-performance, low-power Snapdragon Automotive Platforms across all major vehicle domains as well as contribute to securing Stellantis’ supply chain on strategic components.
“Our technology collaboration with Qualcomm Technologies is another example of how we are identifying industry leaders to work alongside our passionate and talented internal teams as we transform our vehicles through a software-defined approach. This will ultimately better meet the needs of our customers’ lifestyles through safe, personalized, and always-connected features,” said Carlos Tavares, Stellantis CEO. “Qualcomm Technologies’ broad experience in automotive and scale as a semiconductor leader will enable us to vertically integrate key elements of our new platforms and more closely manage the complete electronics supply chain to provide access to the best technologies enable the fulfillment of Stellantis’ volume potential and achieve our Dare Forward 2030 ambition.”
“Qualcomm is honored to expand our work with Stellantis to redefine vehicles in the 21st century by bringing Snapdragon Digital Chassis solutions to their future vehicles,” said Cristiano Amon, President and CEO, Qualcomm Incorporated. “By creating open, scalable, and comprehensive automotive platforms that encompasses semiconductors, systems, software, and services, we are empowering Stellantis, as well as the broader automotive ecosystem, to lead the transformation to the digital era of automobiles.”
Taking the driver-vehicle relationship to the next level, Stellantis will use next-generation Snapdragon Cockpit Platforms to power the in-car communication and infotainment systems for STLA SmartCockpit, which is being designed and engineered together with Amazon and Foxconn. Snapdragon Cockpit Platforms are not only engineered to deliver high-definition graphics to touch and voice-controlled cockpit console, but to also deliver a fully immersive in-cabin experience, enabling premium audio and crystal-clear voice communications throughout the vehicle’s cabin.
Snapdragon Cockpit Platforms will also be used to enhance STLA Brain, bringing a new level of digital intelligence for convenience and safety, and helping to enhance the in-vehicle personal assistant capabilities with highly intuitive artificial intelligence (AI) features, which includes:
- Over-the-air (OTA) updates that will allow the vehicle to naturally evolve and improve over time by being constantly updated, upgraded and enhanced, as well as features on demand and instant vehicle upgrades, such as additional horsepower or drive modes
- Personalized experiences, leveraging AI to adapt to a wide variety of customer preferences
- Improved user experiences, thanks to faster communication with connected features and higher computation power to support future upgrades
- Continuous exciting new services and solutions
- Always-connected experiences
- Improved ownership experiences with diagnostics and repair completed over the air for all major vehicle systems
The first application will be in the Maserati brand to power the next generation Stellantis infotainment system.
Suggested Items
The 500 Largest Cellular IoT Deployments Together Account for 632 Million Units
12/23/2024 | Berg InsightBerg Insight presents its yearly updated database covering the 500 largest cellular IoT deployments identified as part of the company’s world-class IoT market research activities since 2004.
Flexible Printed Circuit Boards Market Expected to Reach $51.05 Billion by 2031 at a CAGR of 11.2%
12/20/2024 | EINPresswire.comA new report by Coherent Market Insights forecasts the global flexible printed circuit boards (FPCB) market to reach $51.05 billion by 2031, reflecting a strong compound annual growth rate (CAGR) of 11.2% from 2024.
Automotive PCB Market Share to Rise at 5.4% CAGR, to Reach $16.43 Billion by 2034
12/18/2024 | Globe NewswireThe global automotive PCB market size is projected to grow from USD 9.72 billion in 2024 to USD 16.43 billion by 2034, at a CAGR of 5.4%, according to a new report by Polaris Market Research.
DENSO, onsemi Collaborate for a Strengthened Relationship
12/17/2024 | JCN NewswireDENSO CORPORATION and onsemi announced today that they are strengthening their long-term relationship to support the procurement of autonomous driving (AD) and advanced driver assistance systems (ADAS) technologies.
ROHM’s PMICs for SoCs have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits
12/13/2024 | ROHMROHM has announced the adoption of its PMICs in power reference designs focused on the next-generation cockpit SoCs ‘Dolphin3’ (REF67003) and ‘Dolphin5’ (REF67005) by Telechips, a major fabless semiconductor manufacturer for automotive applications headquartered in Pangyo, South Korea.