Beyond Design: AI-driven Inverse Stackup Optimization
Global PCB Connections: Following DFM Rules Leads to Better Boards
Elementary Mr. Watson: How to Reinvent Your Professional Journey
Effects of Advanced Packaging and Stackup Design
December 26, 2024 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Kris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup.
Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Kris, tell us how advanced packaging can impact stackup design. What challenges do designers need to be aware of?
Kris Moyer: With advanced packaging you usually need to use HDI or UHDI technology. This usually means sequential lamination. With sequential lamination you need to select materials that can survive multiple lamination thermal cycles.
When we were discussing advanced packaging and stackup design recently, you said, “The rules we used to live by are no longer valid.” Expand on that a little bit.
As I mentioned, your selection of materials is now further restricted by the need for materials that survive multiple lamination cycles. Additionally, since we are adding layers one at a time and need plating on all layers, not just the outer layers, the copper design is now more difficult. Also, since we are adding layers one at a time, we can now have some select instances of unbalanced Z-axis and still meet bow and twist. Furthermore, many of the ultra-thin dielectric layers used in HDI/UHDI are just resin-coated copper without any reinforcement, so CTE/FA can be more of an issue.
To read this entire conversation, which appeared in the December 2024 issue of Design007 Magazine, click here.
Share on:
Suggested Items
SP Manufacturing Expands with New Malaysia Plant, Acquires Ideal Jacobs
12/26/2024 | PRNewswireSP Manufacturing (SPM), a leader in Electronic Manufacturing Services (EMS), is strengthening its global presence with two major moves: opening a new manufacturing facility in Senai, Malaysia, and successfully acquiring Ideal Jacobs Corporation.
Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project
12/25/2024 | RobosysAdvanced maritime autonomy developer, Robosys Automation, supported by USV manufacturer, ACUA Ocean, and Offshore Renewable Energy Catapult (OREC), have jointly secured grant funding through Innovate UK.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.
Spotlight on PEDC: Filbert Arzola
12/19/2024 | Andy Shaughnessy, Design007 MagazineIPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.