-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
The 500 Largest Cellular IoT Deployments Together Account for 632 Million Units
December 23, 2024 | Berg InsightEstimated reading time: 1 minute
Berg Insight presents its yearly updated database covering the 500 largest cellular IoT deployments identified as part of the company’s world-class IoT market research activities since 2004. The extensive list includes various types of projects and product categories deployed across all types of vertical markets including OEM automotive, aftermarket automotive, transport & logistics, utilities, infrastructure, buildings & security, retail, industrial, consumer electronics, healthcare and other. The database includes project size and geographical distribution by the end of 2023 as well as a 5-year forecast for each individual project.
“The projects included in the top-500 list together account for approximately 632 million active cellular IoT subscriptions”, said Rickard Andersson, Principal Analyst, Berg Insight. He adds that this corresponds to as much as 19.3 percent of the total number of cellular IoT connections worldwide at the end of 2023. The 500 projects on the list are in the coming years forecasted to grow to 1.05 billion units by 2028, corresponding to an overall compound annual growth rate (CAGR) of 10.7 percent. “More than 100 deployments on the list have surpassed 1 million subscriptions, and the top-10 projects alone account for 210 million units”, continued Mr. Andersson. Transport & logistics is the largest vertical in terms of the number of projects that made the top list, followed by utilities, retail, aftermarket automotive, OEM automotive, buildings & security and healthcare. “When comparing the number of active subscriptions represented by each vertical for the entries in the top-500 list, OEM automotive is instead the largest vertical, accounting for 230 million units, ahead of utilities at 139 million units and transport & logistics representing 105 million units.”, concluded Mr. Andersson.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.