Stellantis, Qualcomm Collaborate to Power New Vehicle Platforms with Snapdragon Digital Chassis Solutions
April 14, 2022 | Qualcomm Technologies, Inc.Estimated reading time: 2 minutes
Stellantis N.V. and Qualcomm Technologies, Inc. announced a multi-year technology collaboration to utilize the latest Snapdragon Digital Chassis advancements to deliver intelligent, customizable and immersive in-vehicle experiences to millions of vehicles across Stellantis’ 14 iconic automotive brands beginning in 2024. Leveraging the Snapdragon® Cockpit Platforms and 5G capabilities for telematics systems, Stellantis will have the capability to meet customers’ evolving expectations for personalized and cutting-edge experiences that are continually upgradeable.
This agreement will facilitate Stellantis’ plan to merge all software domains into High Performance Computers, leveraging the high-performance, low-power Snapdragon Automotive Platforms across all major vehicle domains as well as contribute to securing Stellantis’ supply chain on strategic components.
“Our technology collaboration with Qualcomm Technologies is another example of how we are identifying industry leaders to work alongside our passionate and talented internal teams as we transform our vehicles through a software-defined approach. This will ultimately better meet the needs of our customers’ lifestyles through safe, personalized, and always-connected features,” said Carlos Tavares, Stellantis CEO. “Qualcomm Technologies’ broad experience in automotive and scale as a semiconductor leader will enable us to vertically integrate key elements of our new platforms and more closely manage the complete electronics supply chain to provide access to the best technologies enable the fulfillment of Stellantis’ volume potential and achieve our Dare Forward 2030 ambition.”
“Qualcomm is honored to expand our work with Stellantis to redefine vehicles in the 21st century by bringing Snapdragon Digital Chassis solutions to their future vehicles,” said Cristiano Amon, President and CEO, Qualcomm Incorporated. “By creating open, scalable, and comprehensive automotive platforms that encompasses semiconductors, systems, software, and services, we are empowering Stellantis, as well as the broader automotive ecosystem, to lead the transformation to the digital era of automobiles.”
Taking the driver-vehicle relationship to the next level, Stellantis will use next-generation Snapdragon Cockpit Platforms to power the in-car communication and infotainment systems for STLA SmartCockpit, which is being designed and engineered together with Amazon and Foxconn. Snapdragon Cockpit Platforms are not only engineered to deliver high-definition graphics to touch and voice-controlled cockpit console, but to also deliver a fully immersive in-cabin experience, enabling premium audio and crystal-clear voice communications throughout the vehicle’s cabin.
Snapdragon Cockpit Platforms will also be used to enhance STLA Brain, bringing a new level of digital intelligence for convenience and safety, and helping to enhance the in-vehicle personal assistant capabilities with highly intuitive artificial intelligence (AI) features, which includes:
- Over-the-air (OTA) updates that will allow the vehicle to naturally evolve and improve over time by being constantly updated, upgraded and enhanced, as well as features on demand and instant vehicle upgrades, such as additional horsepower or drive modes
- Personalized experiences, leveraging AI to adapt to a wide variety of customer preferences
- Improved user experiences, thanks to faster communication with connected features and higher computation power to support future upgrades
- Continuous exciting new services and solutions
- Always-connected experiences
- Improved ownership experiences with diagnostics and repair completed over the air for all major vehicle systems
The first application will be in the Maserati brand to power the next generation Stellantis infotainment system.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
SK keyfoundry, in Collaboration with LB Semicon, Co-Develops Direct RDL to Advance Semiconductor Packaging
07/21/2025 | SK keyfoundrySK keyfoundry, an 8-inch pure-play foundry in Korea, announced that it has successfully co-developed core technology and completed reliability testing of Direct RDL (Redistribution Layer) – a core semiconductor packaging technology based on 8-inch wafers – in collaboration with LB Semicon.
System Basis Chip Market Size Worth USD 66.30 Billion by 2032, at a CAGR of 11.40%
07/18/2025 | Globe NewswireAccording to the SNS Insider, “The System Basis Chip Market was valued at USD 25.10 billion in 2023 and is projected to reach USD 66.31 billion by 2032, growing at a CAGR of 11.40% from 2024 to 2032”.
TI Honored by Volkswagen Group for Operational Excellence
07/16/2025 | Texas InstrumentsTexas Instruments (TI) received the prestigious “Operational Excellence” award at the annual Volkswagen Group Award 2025 in Wolfsburg, Germany.
Japan's Car Industry Has Highest Robot Installations in Five Years
07/15/2025 | IFRThe Japanese automotive industry installed a total of about 13,000 industrial robots in 2024. This is an 11% increase compared to the previous year and the highest level recorded since 2020.
GlobalLogic, Volvo Cars Deepen Collaboration to Engineer the Future of Mobility
07/09/2025 | GlobalLogicGlobalLogic Inc., a Hitachi Group Company and leader in digital engineering, has announced it has been selected in Volvo Cars’ partnership ecosystem as one of the strategic partners within engineering services globally.