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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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NOR Flash, SLC NAND Prices Surge Over 100% in 1H26, Shortages to Persist in 2H26

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Major memory suppliers continue to prioritize capacity allocation toward higher-value products such as HBM and advanced-layer 3D NAND, according to TrendForce’s latest research on the memory industry.

Advanced Packaging: A Central Axis of Innovation in A&D, Automotive

06/11/2026 | I-Connect007 Editorial Team
Presenters in the Aerospace & Defense Special Session at APEX EXPO 2026 made one message abundantly clear: Advanced packaging has moved from a supporting role to a primary system enabler, particularly in high-reliability markets where performance, longevity, and environmental resilience are non-negotiable. The March Technical Conference at APEX EXPO focused on advanced electronics for the first time this year, with two Special Sessions featuring a carefully curated selection of presentations examining how design priorities, material choices, and manufacturing strategies are evolving in response to these demands.

GlobalFoundries Completes Acquisition of Synopsys’ Processo

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GlobalFoundries announced the completion of its previously announced acquisition of Synopsys’ ARC Processor IP Solutions business.

Valeo, Zuken Join Forces to Redefine Automotive Electronic Design

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Rogers Corporation Appoints Ali El-Haj Chief Executive Officer

05/21/2026 | Rogers Corporation
Rogers Corporation announced that its Board of Directors has appointed Ali El-Haj as President and Chief Executive Officer of the Company and a member of the Company’s Board of Directors, effective today.
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