Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Real Time with... THECA 2026: MacDermid Alpha Electronics Solutions Showcases Advanced PCB Process Solutions

09/14/2026 | Real Time with... THECA
Dr. Harry Yang, Vice President-Commercial Asia at MacDermid Alpha Electronics Solutions, highlights new PCB process technologies presented at the THECA show. The discussion covers pulse electroplating for AI-server applications, through-hole filling, and direct metallization. Dr. Yang also explains how the company's expanded Bangkok laboratory and on-site support are helping customers pursue China-plus-one manufacturing strategies more efficiently.

Real Time with... THECA 2026: Thailand's Electronics Industry Growth and Challenges

09/10/2026 | Real Time with... THECA
Expressing pride in this year's THECA event and some of the challenges encountered in putting together the important event, Phutana Daoruang, general manager of THPCA, discusses the rapid growth of Thailand's PCB, EMS, and chip packaging industries and the critical workforce shortage. He also outlines strategic initiatives to address these challenges and foster industry development.

Carano and ElectronicsU Debut New Course on Advanced Packaging

09/04/2026 | Nolan Johnson, I-Connect007
Mike Carano is an industry pioneer with deep expertise across multiple domains. In his latest course for the Global Electronics Association’s ElectronicsU platform, “Advanced Packaging: HDI Enabling Technology,” Carano delivers some of the first educational material introducing advanced packaging to the printed circuit supply chain. In this interview, he discusses the course content, target audience, and motivation for creating the course. 

Removing the Bottleneck: ZOT's Transition to Direct Imaging

08/05/2026 | Marcy LaRont, I-Connect007
For many PCB fabricators, solder mask imaging can become one of the biggest constraints on production. Traditional exposure methods often involve lengthy setup times, multiple process steps, and opportunities for registration errors, leading to costly rework. ZOT Engineering Ltd., a UK-based contract electronics manufacturer specializing in PCB fabrication and assembly, recently modernized this part of its process by partnering with Schmoll Maschinen to deploy a maskless direct imaging (MDI) system.

American Made Advocacy: PCBAA’s Fifth Annual Meeting—Growing Membership and Valuable Relationships

07/21/2026 | Shane Whiteside -- Column: American Made Advocacy
The Printed Circuit Board Association of America recently celebrated its fifth anniversary. We began with five member companies that banded together to influence legislation favorable to our industry. Today, we have 90 members across the entire ecosystem: OEMs, fabricators, assemblers, materials providers, testing companies, and applied AI startups. Our membership ranges from companies with long histories to ventures just embarking on their PCB journeys.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in