-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
MacDermid Alpha to Promote New ALPHA Argomax AccuLam Sintering Film and Package Attach Sintering Application at PCIM Europe
May 4, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will showcase its latest sintering process solutions, including the new ALPHA Argomax AccuLam Sintering Film, at the upcoming PCIM exhibition in Nuremberg, Germany from Tuesday 10th - Thursday 12th May in Hall 7 Booth #227.
ALPHA Argomax AccuLam is the next revolution in Sintering Film, delivering higher throughput and larger area lamination compatibility whilst being uniquely customized for a customer’s requirements. The film is part of the range of ALPHA Argomax Sinter Process Solutions which also includes paste for printing and dispense and preforms specially engineered for Top Side Attach, Die Attach, Wafer Attach and Package Attach processes.
A key highlight at the MacDermid Alpha booth will be demonstrations of ALPHA Argomax in the package attach process using a sintering press. The successful sintering of molded power packages is possible due to the lower pressure, lower temperature, and faster sinter times enabled by ALPHA Argomax. The paste ensures intimate contact between the package and the heat-sink, accommodates warpage, and sinters with low pressure without cracking the molded module. ALPHA Argomax, based on proprietary nano-particles technology, is the preferred sintering solution for package to heat-sink attach with demonstrated 10X improvement in power cycling reliability.
Suggested Items
Dragonfly Energy Announces Breakthrough in Lithium Battery Production: Eliminating Harmful 'Forever Chemicals'
05/09/2024 | Globe NewswireDragonfly Energy Holdings Corp., an industry leader in green energy storage, has made a significant breakthrough in battery manufacturing with the successful production of PFAS-free electrodes in lithium battery cells.
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
Altus Equips SSTL with Advanced Cleaning Technology for Electronics
05/07/2024 | Altus GroupAltus Group, a leading supplier of capital equipment for the electronics manufacturing industry, has announced the successful installation of an advanced PCBA cleaning system at Surrey Satellite Technology Limited (SSTL).
RTX's Advanced Ground System for Space-based Missile Warning Now Operational
05/06/2024 | RTXAn advanced ground system for space-based missile warning developed by Raytheon, an RTX business, is now operational at the U.S. Space Force's Overhead Persistent Infrared Battlespace Awareness Center (OBAC).
BrainChip, Frontgrade Gaisler to Augment Space-Grade Microprocessors with AI Capabilities
05/06/2024 | BUSINESS WIREBrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, and Frontgrade Gaisler, a leading provider of space-grade system-on-chip solutions, announce their collaboration to explore the integration of BrainChip’s AkidaTM neuromorphic processor into Frontgrade Gaisler’s next generation fault-tolerant, radiation-hardened microprocessors.