Beyond Design: Slaying Signal Integrity Villains
Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
Ventec to Host Live Webinar on Thermal Management with IMS
May 12, 2022 | VentecEstimated reading time: 1 minute
Ventec International Group Co., Ltd. (6672 TT) is pleased to announce that it will be hosting a live webinar on ‘Top design techniques for thermal management with IMS’ on Thursday, June 23 at 3:00 p.m. CET / 9:00 a.m. EST. Presented by IMS technology expert Robert Art, the webinar is geared towards helping PCB Designers, OEMs and PCB Manufacturers optimize the thermal performance, reliability, and quality of their designs with high-performance IMS materials.
Insulated metal substrate (IMS) technology provides an elegant and economical solution for managing component temperatures in electronic applications such as computing, lighting, and power supplies for a wide range of markets and environments. Identifying a suitable IMS to maintain components at a desired operating temperature enables engineers to design products that enjoy several advantages in the marketplace:
- Superior reliability
- Smaller size
- Attractive appearance
- Competitive price
Ventec’s free webinar on thermal management with IMS will review popular applications, provide top tips and best practices on IMS material selection and the options that are available to help designers and engineers overcome thermal-management challenges and achieve the thermal performance needed to achieve their targets.
Date: Thursday, 23rd June 2022
Time: 3:00 p.m. (CET) / 9:00 a.m. (EST)
To register, click here.
For more information about Ventec's solutions and the company’s wide variety of products, please visit www.venteclaminates.com.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Blaize, Technology Control Company Partner to Power Saudi Arabia’s Next-Generation AI Innovation Infrastructure
09/17/2025 | BUSINESS WIREBlaize Holdings, Inc., a leader in programmable, energy-efficient edge AI computing, and Technology Control Company (TCC), a leading technology solutions provider in the Kingdom of Saudi Arabia (KSA), announced a strategic partnership to advance Saudi Arabia’s AI innovation infrastructure and accelerate its digital transformation goals.
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
Altair, Wichita State University’s NIAR Sign MoU to Accelerate Aerospace Innovation
09/16/2025 | AltairAltair, a global leader in computational intelligence, and Wichita State University’s (WSU) National Institute for Aviation Research (NIAR), one of the world’s leading aerospace research institutions, have signed a memorandum of understanding (MoU) to advance innovation across the aerospace and defense industries.