- design007 Magazine
Latest IssuesCurrent Issue
In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
- Events||| MENU
- design007 Magazine
Ventec to Host Live Webinar on Thermal Management with IMSMay 12, 2022 | Ventec
Estimated reading time: 1 minute
Ventec International Group Co., Ltd. (6672 TT) is pleased to announce that it will be hosting a live webinar on ‘Top design techniques for thermal management with IMS’ on Thursday, June 23 at 3:00 p.m. CET / 9:00 a.m. EST. Presented by IMS technology expert Robert Art, the webinar is geared towards helping PCB Designers, OEMs and PCB Manufacturers optimize the thermal performance, reliability, and quality of their designs with high-performance IMS materials.
Insulated metal substrate (IMS) technology provides an elegant and economical solution for managing component temperatures in electronic applications such as computing, lighting, and power supplies for a wide range of markets and environments. Identifying a suitable IMS to maintain components at a desired operating temperature enables engineers to design products that enjoy several advantages in the marketplace:
- Superior reliability
- Smaller size
- Attractive appearance
- Competitive price
Ventec’s free webinar on thermal management with IMS will review popular applications, provide top tips and best practices on IMS material selection and the options that are available to help designers and engineers overcome thermal-management challenges and achieve the thermal performance needed to achieve their targets.
Date: Thursday, 23rd June 2022
Time: 3:00 p.m. (CET) / 9:00 a.m. (EST)
To register, click here.
For more information about Ventec's solutions and the company’s wide variety of products, please visit www.venteclaminates.com.
Global IT corporation FPT recently signed a Memorandum of Understanding (MoU) with the multinational industrial technology conglomerate Siemens, fostering collaboration and mutually beneficial business opportunities in advancing the manufacturing sector and semiconductor chip production while accelerating digital transformation globally.
Wearable Devices Ltd. , a technology growth company specializing in artificial intelligence (“AI")-powered touchless sensing wearables, today announced a collaboration agreement with Qualcomm Technologies, Inc. This collaboration will help those looking to use Wearable Devices' innovative Mudra technology when developing products using the Qualcomm Snapdragon Spaces™ XR Developer Platform, redefining interaction in augmented reality (“AR”) and virtual reality (“VR”) environments.
Coffee has helped power people for years. Now, coffee and other bio-based resources may help power lithium-ion batteries, thanks to breakthrough technology from X-BATT®.
StenTech® Inc., a leading global company specializing in SMT Printing Solutions, has completed a major technology update to their Photo Stencil Specialized Products Division in Golden, Colorado. The phase-one overhaul included upgrades to key areas, including imaging, chemical plating, and chemical coating, along with refreshed offices and board room.
SMTA will be hosting a new symposium on March 26th in Phoenix focused on Ultra High-Density Interconnect (HDI) technology. As the semiconductor industry charges forward, demanding ever-increasing performance and miniaturization, the SMTA Ultra HDI Symposium sets the stage for industry pioneers, researchers, engineers, designers, and academia to engage in the active sharing of information while addressing the complexities and innovations reshaping the world of Ultra HDI technology.