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Current IssuePartial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
Cost Drivers
In this month’s issue of Design007 Magazine, our expert contributors explain the impact of cost drivers on PCB designs and the need to consider a design budget. They discuss the myriad design cycle cost adders—hidden and not so hidden—and ways to add value.
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IPC Training Course on PCB Design for Embedded Components
June 3, 2022 | IPCEstimated reading time: Less than a minute
IPC will be holding a training course on PCB design for embedded components. The course will be held every Mondays and Wednesdays, 11:00 a.m. to 1:00 p.m., starting from August 6 until September 14, 2022.
The course will provide attendees the skills necessary to effectively implement designs requiring embedded components in accordance with product requirements. The class also focuses on PWB/PBA designs that require advanced or complex packaging, have reduced available board area, have reduced physical component count, and require improved signal integrity performance. Participants will also learn about the impact of these designs on manufacturing and assembly techniques, documentation, and manufacturing file generation.
Taught by an IPC-certified industry expert with more than 25 years of experience in the field, the six-week program utilizes interactive webinars, on-demand recorded class sessions, job-specific exercises, and team projects to facilitate mastery of the key concepts required to design boards containing embedded components.
For more information or to register, visit IPC’s website.
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The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.