- design007 Magazine
Latest IssuesCurrent Issue
In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
- Events||| MENU
- design007 Magazine
Zuken’s eCADSTAR Release 2022 Enhances the Capabilities of Engineers to Efficiently Create Feature-Rich DevicesJune 22, 2022 | Zuken
Estimated reading time: 2 minutes
The eCADSTAR 2022 release advances Zuken’s position to bring powerful and intuitive circuit and PCB design tools to the desktop space. The electrical computer-aided design (ECAD) markets in the US and Europe are projected to reach a combined $1.5B. Nearly 60% of the total ECAD market is desktop development comprised of small- to medium-sized organizations, which eCADSTAR specifically targets. For this release of eCADSTAR, the development team in Bristol, UK, focused on addressing some of the top requests from our user base while maintaining a consistent and unified platform across the major components of eCADSTAR. This release enables engineers to deliver to tight deadlines with features that allow for the reuse of circuit elements and hierarchy, reduce uncertainty with tools to aid in fine-tuning high-speed circuit elements, and create densely populated circuit boards with semi-automated guidance.
“As roles expand, engineers are now looking for a design, analysis, and layout solution. eCADSTAR 2022 is a response to specific customer requests for more emphasis on organization and reuse of full and partial designs, advanced fine-tuning of high-speed circuitry, and automation-assisted layout and modification of densely populated PCB layouts.”, says Chris Hambleton, Engineering General Manager, Zuken.
Hierarchy for Scale
Design reuse is necessary to meet today’s ever-shortening design cycles. eCADSTAR 2022 supports design reuse by introducing a multi-instanced hierarchy which makes it possible to create reusable circuit blocks such as memory channels or amplifier lineups.
Intuitive 3D Model Management Library
eCADSTAR’s ability to incorporate 3D mechanical models within a PCB design is one of its more powerful features. The 2022 release enhances the ability of users to organize and navigate 3D models by way of a new 3D Model Management Library. Users can more quickly navigate and implement 3D models into their designs.
Enhanced Accuracy and Capability of High-Speed and High-Frequency Circuit Design
The ability to analyze board cross-sections and define board stack-ups has been streamlined and gives the engineer more control over the definition of physical board parameters. eCADSTAR can now consider non-ideal manufacturing nuances that will result in a more realistic representation of the finished product during simulation.
Semi-Automatic Interactive Routing
The 2022 release of eCADSTAR accelerates the go-to-market time with the introduction of “push-aside.” This feature enables engineers to easily adjust the position of board elements without having to manually move components that obstruct their new location. Now, two operations can be accomplished in one instance.
Reuse of Component Placement
Finding the optimal placement of components is one of the most challenging aspects of circuit board design, and eCADSTAR 2022 has a new feature that allows engineers to reuse component placement. The component locations of the entire board or part of a board can be saved and exported. That data can then be used to populate a new board with those critical component locations, saving significant time.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop01/25/2024 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering09/18/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.