-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Master the Art of Communication With Manufacturers
June 30, 2022 | Kyle Burk, KBJ EngineeringEstimated reading time: 2 minutes

Design with manufacturing (DWM) emphasizes the important aspect of the true intent of design for manufacturing (DFM). The intent of DFM is to consider the manufacturing process during the entire printed circuit design process starting at the earliest stages of the design cycle, when the project first begins, and continuing to the end of the product lifecycle.
As mentioned in the May issue of Design007 Magazine, design is performed, at times, in a vacuum. But it doesn’t have to be that way. Whenever circumstances allow, design should be performed by communicating with all stakeholders throughout the design process, hence the emphasis on the word with in DWM. Communication can occur through personal correspondence such as email and voice conversations or through more formal design meetings—in person or through videoconferencing. No matter which means of communication you prefer, it’s important to communicate early and often with stakeholders involved in the downstream processes as you bring your project to realization.
There’s No ‘I’ in Team
Unlike the word “team,” there is an “I” in design with manufacturing, but that doesn’t make it a singular process. Rather, DWM requires involvement of a cross-functional team with the designer as the key stakeholder who communicates regularly with the team throughout the design process. This communication includes receiving feedback early from other stakeholders and implementing any improvements they suggest.
The higher-level structure of DWM takes effort but yields superior results because it helps the designer avoid delays while lowering manufacturing costs and maintaining a high-quality finished product. For example, deadlines are more likely to be met by communicating early with the assembly team on bill of materials component availability. For those designers using revision control, communicating early can help avoid the costly process of rolling a revision for minor last-minute design changes. Communicating with the fabrication team before beginning assembly can help lower manufacturing costs and turn times by discovering cost reduction opportunities, such as combining similar drill sizes.
DWM seeks to unify all stakeholders of the circuit board design and development process, including the designer, fabricator, and assembler. For components with specific requirements, DWM may also include involving the component manufacturer. The final complete data package sent to the assembler includes drawings, specifications, requirements, ratings, a bill of materials, Gerber, and drill data, etc.
DWM thus requires contributions and feedback from members of the team most familiar with the different documents of the data package. The designer should review preliminary Gerber and drill data with the fabricator to ensure the design is manufacturable. They should also discuss the bill of materials with the assembler to make certain that all components are available for purchase. Each document of the data package should be reviewed by an expert in the corresponding process.
To read this entire article, which appeared in the June 2022 issue of Design007 Magazine, click here.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.