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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Atotech to Participate at Connector User Congress 2022 | Anwenderkongress Steckverbinder
July 1, 2022 | AtotechEstimated reading time: Less than a minute
Atotech, a leading specialty chemicals technology company and a market leader in advanced electroplating solutions, will take part in the Connector User Congress | Anwenderkongress Steckverbinder, running from July 4 through July 6, 2022 in Würzburg, Germany. The show provides an opportunity for industry partners to connect and network.
Atotech’s product experts are looking forward to exchange with visitors on the latest market and technology trends and requirements of connector designs and applications at booth # 26.
The company’s latest product innovations for connector applications include:
- Silvertech® RBH – hard silver electrolyte for electric vehicles applications, e.g. power train bus bars and connectors
- Stannopure® PF10 – green tin plating process for connectors and lead frames
- Novoplate® NIW – bright nickel-tungsten plating process with approximately 20% W designed to increase corrosion and wear resistance for connector applications
- Argalin® XL – solution for high performance and temperature stable anti-tarnish for silver and copper deposits
- Protectostan® Plus 3 – green (PFAS free) post dip for tin to preserve solderability under steam or heat
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SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition
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Fresh PCB Concepts: PCB Plating Process Overview
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