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Atotech to Participate at Connector User Congress 2022 | Anwenderkongress Steckverbinder
July 1, 2022 | AtotechEstimated reading time: Less than a minute
Atotech, a leading specialty chemicals technology company and a market leader in advanced electroplating solutions, will take part in the Connector User Congress | Anwenderkongress Steckverbinder, running from July 4 through July 6, 2022 in Würzburg, Germany. The show provides an opportunity for industry partners to connect and network.
Atotech’s product experts are looking forward to exchange with visitors on the latest market and technology trends and requirements of connector designs and applications at booth # 26.
The company’s latest product innovations for connector applications include:
- Silvertech® RBH – hard silver electrolyte for electric vehicles applications, e.g. power train bus bars and connectors
- Stannopure® PF10 – green tin plating process for connectors and lead frames
- Novoplate® NIW – bright nickel-tungsten plating process with approximately 20% W designed to increase corrosion and wear resistance for connector applications
- Argalin® XL – solution for high performance and temperature stable anti-tarnish for silver and copper deposits
- Protectostan® Plus 3 – green (PFAS free) post dip for tin to preserve solderability under steam or heat
Suggested Items
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.