The Power of Consistency: Showing Up Every Day is Half the Battle
The Chemical Connection: Getting the Best from Your Cupric Chloride Etchant
Dan’s Biz Bookshelf: ‘Born to Create’
Atotech to Participate at Connector User Congress 2022 | Anwenderkongress Steckverbinder
July 1, 2022 | AtotechEstimated reading time: Less than a minute
Atotech, a leading specialty chemicals technology company and a market leader in advanced electroplating solutions, will take part in the Connector User Congress | Anwenderkongress Steckverbinder, running from July 4 through July 6, 2022 in Würzburg, Germany. The show provides an opportunity for industry partners to connect and network.
Atotech’s product experts are looking forward to exchange with visitors on the latest market and technology trends and requirements of connector designs and applications at booth # 26.
The company’s latest product innovations for connector applications include:
- Silvertech® RBH – hard silver electrolyte for electric vehicles applications, e.g. power train bus bars and connectors
- Stannopure® PF10 – green tin plating process for connectors and lead frames
- Novoplate® NIW – bright nickel-tungsten plating process with approximately 20% W designed to increase corrosion and wear resistance for connector applications
- Argalin® XL – solution for high performance and temperature stable anti-tarnish for silver and copper deposits
- Protectostan® Plus 3 – green (PFAS free) post dip for tin to preserve solderability under steam or heat
Share on:
Suggested Items
Growth Unfolds: The First of STARTEAM’s Trio of Factories Set to Expand
12/05/2024 | STARTEAM GLOBALSTARTEAM is thrilled to share news of our upcoming 3-step expansion at JST, with each step adding 50,000m² per month which began on May 27, 2024. This carefully planned extension is designed to significantly increase our production capacity and expand our talented team. Currently, our production space covers 30,000m². Through this expansion, we are setting our sights on incrementally increasing our capacity from 70,000m²/month to a remarkable 130,000m²/month.
Connect the Dots: Designing for Reality: Strip-Etch-Strip
12/05/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we focused on pattern plating. At this point, we are close to completing our boards and ready for the strip-etch-strip (SES) process. By this stage of the manufacturing process, we have laminated all the internal layers together, drilled the through-holes, applied the image to the external layers through photoresist, plated the copper in those channels to beef up the copper thickness for traces, pads, and through-holes, added a layer of electrolytic tin over the top of that copper to protect it during subsequent stages of production.
Fresh PCB Concepts: PCB Design Essentials for Electric Vehicle Charging
11/27/2024 | Team NCAB -- Column: Fresh PCB ConceptsElectric vehicles (EVs), powered by electricity rather than fossil fuels, are transforming transportation and reducing environmental impacts. But what good is an EV if it can't be easily charged? In this month's column, Ramon Roche dives into the role of printed circuit boards (PCBs) in electric vehicle charging (EVC)—and the design considerations.
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in