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Atotech to Participate at Connector User Congress 2022 | Anwenderkongress Steckverbinder
July 1, 2022 | AtotechEstimated reading time: Less than a minute
Atotech, a leading specialty chemicals technology company and a market leader in advanced electroplating solutions, will take part in the Connector User Congress | Anwenderkongress Steckverbinder, running from July 4 through July 6, 2022 in Würzburg, Germany. The show provides an opportunity for industry partners to connect and network.
Atotech’s product experts are looking forward to exchange with visitors on the latest market and technology trends and requirements of connector designs and applications at booth # 26.
The company’s latest product innovations for connector applications include:
- Silvertech® RBH – hard silver electrolyte for electric vehicles applications, e.g. power train bus bars and connectors
- Stannopure® PF10 – green tin plating process for connectors and lead frames
- Novoplate® NIW – bright nickel-tungsten plating process with approximately 20% W designed to increase corrosion and wear resistance for connector applications
- Argalin® XL – solution for high performance and temperature stable anti-tarnish for silver and copper deposits
- Protectostan® Plus 3 – green (PFAS free) post dip for tin to preserve solderability under steam or heat
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Sweeney Ng - CEE PCBSuggested Items
Nolan’s Notes: Tariffs, Technologies, and Optimization
10/01/2025 | Nolan Johnson -- Column: Nolan's NotesLast month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade agreements to the least favorable. Electronics continue to be exempt for the time being, but lest you think that we’re free and clear because we manufacture electronics, steel and aluminum are specifically called out at the 50% tariff levels.
MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
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Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.