-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
July 1, 2022 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
The summer is heating up, and our news this week is on fire, literally. Eltek has resumed making deliveries after a fire at their facility in Petach-Tikva, Israel. There’s never a dull moment in this industry.
And we have some good news: EIPC’s conferences are now live events again, and Editor Pete Starkey is back in the saddle, bringing us a review of the two-day conference. I know Pete was getting tired of sitting around his house and watching these events on video.
We have a Siemens column that offers an update on some of the CMMC and NIST cybersecurity documents published this year, and their effect on assembly and fabrication providers. (It’s a nice tie-in to our July issue of SMT007 Magazine, which publishes today.) Cadence columnists Jorge Gonzalez and Luke Roberto also discuss the developments in machine learning and artificial intelligence.
And Dan Beaulieu has a great primer for us “mature” adults who aren’t sure what to make of the millennials and younger folks in general. As Dan explains, it may just be a matter of misperception.
Stay cool, everyone!
Eltek Resumes Deliveries to Customers
Published July 1
Eltek Ltd. Is taking care of business on the heels of a fire at an Eltek facility in Petach-Tikva, Israel, and has resumed making deliveries. The company is using an alternative production line while work is under way to repair of the damaged line. Eltek is communicating with customers and its insurance company. That’s good news.
All Systems Go: Accelerate Your PCB Designs with Machine Learning
Published June 30
Though artificial intelligence and machine learning seem to be new concepts, they’ve actually been in development for decades. In this column, Cadence’s Jorge Gonzalez and Luke Roberto trace the lineage of AI and ML, and their path into today’s PCB design software tools. Did you know that we’re in the second modern era of AI? Read on!
EIPC Summer Conference 2022: Day 1 Review
Published June 28
Technology Editor Pete Starkey has been going stir-crazy for the past few years. Up until COVID, this English gentleman attended almost every industry conference in Europe, writing fantastic reviews that often went viral. After years of watching videoconferences of these events, Pete was ready for the road again, and he recently attend this live EIPC conference in Örebro, Sweden. Check out Pete’s coverage, which, as usual, makes you feel like you’re sitting in the audience with him, sipping Earl Gray.
It’s Only Common Sense: Misconceptions About Millennials and How to Embrace Their Truth
Published June 27
My grandmother didn’t think much of the scrappy young Frank Sinatra that my mother was swooning over. It seems that every generation thinks the next one isn’t cut from the best cloth, and the reaction of people my age to Generation Z and the millennials is a case in point. But as Dan Beaulieu points out in this column, many of our beliefs about younger people may be built upon misconceptions. Check it out.
Lean Digital Thread: The Secure Digital Thread
Published June 29
Intellectual property security is a big challenge for manufacturers, and a variety of cybersecurity documents have been published recently. In this column, Zac Elliott of Siemens discusses the U.S. Department of Defense Cybersecurity Maturity Model (CMMC) program, a recent draft released by NIST, and how they affect PCB fabricators and assemblers.
Suggested Items
PI's New Expansion for Higher Electronics Manufacturing Capacities and Shorter Lead Times
11/20/2024 | PRNewswirePI, the market and technology leader for high-precision motion control, positioning technology, and piezo applications, has completed the construction of additional electronics production space at its Rosenheim, Germany site.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.
2024 Stromberg Student Leader Scholarship Recipient Announced
11/05/2024 | SMTASMTA is pleased to announce Waad Tarman, Auburn University, has been selected as the recipient of the 2024 JoAnn Stromberg Student Leader Scholarship.
Indium Announces InnoJoin as Exclusive Global Sales Partner for NanoFoil®
11/04/2024 | Indium CorporationIndium Corporation announced that InnoJoin GmbH will be the exclusive global sales partner for NanoFoil® in component mounting applications. NanoFoil® is a leading nanotechnology material that delivers energy in a controlled and precise manner for joining, energetics, and heating applications.
Flexible Thinking: Musings on High Density Interconnections
10/30/2024 | Joe Fjelstad -- Column: Flexible ThinkingPeople have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.