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IPC Announces First Standards Development Task Group in Japan
July 12, 2022 | IPCEstimated reading time: 1 minute
 
                                                                    For the first time, IPC has formed a task group in Japan. The 7-31 BV-JP IPC J-STD-001/IPC-A-610 Automotive Addendum Task Group held its first meeting on June 14, 2022, to introduce task group members, discuss the IPC Works standards collaboration platform, and create a schedule for future task group meetings.
The automotive addendum requires the use of both IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies along with requirements in the addendum, as it looks at the whole of the electronics assembly manufacturing process from assembly to inspection addressing board reliability requirements for the automotive industry. The 7-32 BV-JP task group will be guided by the principle of providing criteria to be used in addition to, and in some cases, in place of, those in the base documents to ensure the reliability of soldered electrical and electronic assemblies that must survive the automotive environment.
Members of the committee currently include the following companies: Tokai Rika (chair), Toyota Motor Corporation (vice-chair), Denso, Aisin, NSK, Panasonic, SiiX, Omron, Senju, Nihon Superior, Tamura SS, JAXA, NEC Platforms, Ltd., Harima Chemicals Group, Inc., and Japan Aviation Engineering.
Formed to enlist the input of Japan’s automotive industry, the task group encourages comments and proposals. As Yusaku Kono, IPC’s Japan representative, explains, “The goals of this group are to listen to comments from Japan’s automotive industry and to give proposals to the IPC 7-31BV global task group. The members of the group understand the value of providing feedback to strengthen IPC global standards and proactively support that goal.”
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10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
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Better Sustainability Policies for Electronics
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Come Together: Tom Marktscheffel Used Data to Build CFX and a Global Factory Standard
10/27/2025 | Sandy Gentry, Community MagazineWhen Tom Marktscheffel, director of product management software solutions at ASMPT, looks back on his nearly three decades in electronics manufacturing, one word stands out: data. “Data is the new gold,” he says. Without it, automation, artificial intelligence, and the factory of the future are impossible. With it, the industry can move from manual, error-prone processes to smart, connected systems that make real-time decisions.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
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