-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
IPC Announces First Standards Development Task Group in Japan
July 12, 2022 | IPCEstimated reading time: 1 minute
For the first time, IPC has formed a task group in Japan. The 7-31 BV-JP IPC J-STD-001/IPC-A-610 Automotive Addendum Task Group held its first meeting on June 14, 2022, to introduce task group members, discuss the IPC Works standards collaboration platform, and create a schedule for future task group meetings.
The automotive addendum requires the use of both IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies along with requirements in the addendum, as it looks at the whole of the electronics assembly manufacturing process from assembly to inspection addressing board reliability requirements for the automotive industry. The 7-32 BV-JP task group will be guided by the principle of providing criteria to be used in addition to, and in some cases, in place of, those in the base documents to ensure the reliability of soldered electrical and electronic assemblies that must survive the automotive environment.
Members of the committee currently include the following companies: Tokai Rika (chair), Toyota Motor Corporation (vice-chair), Denso, Aisin, NSK, Panasonic, SiiX, Omron, Senju, Nihon Superior, Tamura SS, JAXA, NEC Platforms, Ltd., Harima Chemicals Group, Inc., and Japan Aviation Engineering.
Formed to enlist the input of Japan’s automotive industry, the task group encourages comments and proposals. As Yusaku Kono, IPC’s Japan representative, explains, “The goals of this group are to listen to comments from Japan’s automotive industry and to give proposals to the IPC 7-31BV global task group. The members of the group understand the value of providing feedback to strengthen IPC global standards and proactively support that goal.”
Suggested Items
Shane Whiteside of Summit Reflects on Today's PCB Landscape
05/08/2024 | I-Connect007 Editorial TeamSummit Interconnect began as a printed circuit board manufacturing company just eight years ago and has seen impressive growth organically and through acquisition. Summit President and CEO Shane Whiteside takes a few moments to share his thoughts on the growing PCB industry in the United States.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Micross, Sital Announce Global Manufacturing & Distribution Partnership
05/07/2024 | Micross Components, Inc.Micross Components, Inc., a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space and industrial applications, is pleased to announce our exclusive partnership with Sital Technology (sitaltech.com), the leader in MIL-STD-1553 IP cores, specializing in integrated FPGA solutions.
Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024
05/07/2024 | SEMIWorldwide silicon wafer shipments decreased 5.4% quarter-over-quarter to 2,834 million square inches in the first quarter of 2024, a 13.2% drop from the 3,265 million square inches recorded during the same quarter last year, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.
Nolan’s Notes: Coming to Terms With AI
05/07/2024 | Nolan Johnson -- Column: Nolan's NotesHow fast do things move in the world of data analytics? Here’s an example. We’ve been planning this issue on artificial intelligence for the past few months, and, in fact, I had already written this column about a month ago. Then I went to IPC APEX EXPO and upended it all. I originally had compared AI to drag racing in that (CPU) horsepower and new (data) vehicles have steadily delivered higher performance competition. That seemed pretty accurate given how generative AI models dominated the popular media with amazing results—and sometimes spectacular crashes.