The Pulse: Caught in the Crosshatch—A Cautionary Tale of Detective Work
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
Elementary, Mr. Watson DFX—Basically a Basket of Crabs With Spreadsheets
Electronic System Design Industry Logs 12.1% YoY Revenue Growth in Q1 2022
July 12, 2022 | SEMIEstimated reading time: 1 minute
Electronic System Design (ESD) industry revenue increased 12.1% from $3,157.7 million in Q1 2021 to $3,540.5 million in Q1 2022, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 14.5%.
“The industry continued to report double-digit year-over-year revenue growth in Q1 2022, with quarterly revenue reaching a record $3,540.5 million,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “Product categories Computer-Aided Engineering, Printed Circuit Board and Multi-Chip Module, Semiconductor Intellectual Property, and Services recorded growth for the quarter. Geographically, the Americas, Japan, and Asia Pacific (APAC) all reported revenue growth.”
The companies tracked in the EDMD report employed 51,328 people globally in Q1 2022, a 4.7% increase over the Q1 2021 headcount of 49,024 and up 0.2% compared to Q4 2021.
The quarterly EDMD report contains detailed revenue information with the following category and geographic breakdowns.
Revenue by Product and Application Category – Year-Over-Year Change
- Computer-Aided Engineering (CAE) revenue increased 14.8% to $1,118.2 million. The four-quarter CAE moving average increased 12.5%.
- IC Physical Design and Verification revenue decreased 7.5% to $631.2 million. The four-quarter moving average for the category declined 2.5%.
- Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue increased 1.4% to $293.3 million. The four-quarter moving average for PCB and MCM rose 11.4%.
- Semiconductor Intellectual Property (SIP) revenue jumped 23.7% to $1,376.5 million. The four-quarter SIP moving average grew 26.5%.
- Services revenue increased 22.7% to $121.4 million. The four-quarter Services moving average increased 24.9%.
Revenue by Region – Year-Over-Year Change
- The Americas, the largest reporting region by revenue, procured $1,522.7 million of electronic system design products and services in Q1 2022, an 18.5% increase. The four-quarter moving average for the Americas rose 18%.
- Europe, Middle East, and Africa (EMEA) procured $434.1 million of electronic system design products and services in Q1 2022, a 3% decrease. The four-quarter moving average for EMEA grew 8.1%.
- Japan’s procurement of electronic system design products and services increased 1.8% to $263.5 million. The four-quarter moving average for Japan rose 2.5%.
- Asia Pacific (APAC) procured $1,320.3 million of electronic system design products and services in Q1 2022, a 13.2% increase. The four-quarter moving average for APAC increased 15.6%.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.
Zuken Launches GENESYS 2026 to Broaden Access and Improve MBSE Workflows
04/28/2026 | ZukenZuken announced GENESYS 2026, the latest version of its model-based systems engineering platform, with updates designed to improve performance, expand access to model-based information, and enhance the day-to-day modeling experience for engineering teams.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
Cadence Reports Q1 2026 Financial Results
04/28/2026 | Cadence Design SystemsCadence had a strong start to 2026, delivering a solid Q1 with accelerating AI demand and record backlog, reflecting strong customer commitment to our AI-driven portfolio,” said Anirudh Devgan, president and chief executive officer.
Tomachie Launches AI-Powered PCB Analysis with Smart Test Point Insertion
04/28/2026 | TomachieTomachie announced its AI-Assisted PCB schematic design analysis platform, enabling engineering teams to evaluate and improve schematic quality before layout begins. Schematic errors caught after layout — or in production — cost 10 to 100 times more to fix than those caught during schematic capture.