-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Ultra Librarian Launches Autodesk Fusion 360-Integrated CAD Library App on Autodesk App Store
July 19, 2022 | Ultra LibrarianEstimated reading time: 1 minute
Ultra Librarian, the world's largest CAD library provider, announced the release of the Ultra Librarian app on the Autodesk Fusion 360 app store. Autodesk, a global leader in design and MAKE Technology, collaborated with Ultra Librarian to generate this Fusion 360-compatible app that provides users with free verified schematic symbols, PCB footprints, 3D STEP models, and reference designs from Ultra Librarian directly within the user's software to streamline the design process. Fusion 360 is a cloud-based 3D modeling, CAD, CAM, CAE, and PCB software platform for product design and manufacturing.
The Ultra Librarian app takes the busy work out of designs through access to millions of verified CAD models and native reference designs, all available without ever leaving Fusion 360. “We are thrilled to announce the new Ultra Librarian for Fusion 360 app,” said Frank Frank, product architect for Ultra Librarian. “Due to increased workloads and shortened project deadlines, designers need tools like Ultra Librarian for Fusion 360 to spend more time on innovation and less time on part creation,” he said.
“Autodesk is excited to work with Ultra Librarian to bring its massive content library to our users,” said Matt Berggren, director of Fusion 360 Electronics Design. “For years engineers have struggled with the error-prone, manual creation of library components and, like the Fusion Package Generator, Ultra Librarian has taken a data-driven approach to libraries, automating many of the tasks which would otherwise add risk to user designs. This process has meant the adoption of the Ultra Librarian tools by distributors and manufacturers alike. Our shared goal is to push library authoring below the waterline and make the creation of new parts as painless and error-free as possible. We are excited by what this means for our users and look forward to growing our content offering with Ultra Librarian in ways that make our users more productive,” said Berggren.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.
Zuken Launches GENESYS 2026 to Broaden Access and Improve MBSE Workflows
04/28/2026 | ZukenZuken announced GENESYS 2026, the latest version of its model-based systems engineering platform, with updates designed to improve performance, expand access to model-based information, and enhance the day-to-day modeling experience for engineering teams.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
Cadence Reports Q1 2026 Financial Results
04/28/2026 | Cadence Design SystemsCadence had a strong start to 2026, delivering a solid Q1 with accelerating AI demand and record backlog, reflecting strong customer commitment to our AI-driven portfolio,” said Anirudh Devgan, president and chief executive officer.
Tomachie Launches AI-Powered PCB Analysis with Smart Test Point Insertion
04/28/2026 | TomachieTomachie announced its AI-Assisted PCB schematic design analysis platform, enabling engineering teams to evaluate and improve schematic quality before layout begins. Schematic errors caught after layout — or in production — cost 10 to 100 times more to fix than those caught during schematic capture.