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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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SIA Commends Senate Passage of CHIPS Act, Urges House Approval
July 28, 2022 | SIAEstimated reading time: 1 minute
The Semiconductor Industry Association (SIA) released the following statement from President and CEO John Neuffer commending bipartisan Senate passage of the CHIPS Act of 2022 (H.R. 4346), legislation that would provide $52 billion for semiconductor manufacturing incentives and research investments, as well as an investment tax credit for semiconductor manufacturing.
“Senate passage of the CHIPS Act marks decisive progress toward strengthening America’s economy, national security, and leadership in the key technologies of today and tomorrow. We greatly appreciate the bill’s Senate champions for advancing it, commend today’s strong bipartisan vote, and urge the House of Representatives to swiftly follow suit and send the CHIPS Act to President Biden’s desk to be signed into law. The stakes are high, and the time to act is now.”
The CHIPS Act of 2022 has a total cost of $79.344 billion over 10 years, according to the official scorekeeper for Congress, the non-partisan Congressional Budget Office (CBO). These investments will create hundreds of thousands of American jobs, spur hundreds of billions of dollars in chip company investments in the U.S., and ensure more resilient chip supply chains for key manufacturing industries in the U.S. and for the national security community.
The share of modern semiconductor manufacturing capacity located in the U.S. has decreased from 37% in 1990 to 12% today. This decline is largely due to substantial manufacturing incentives offered by the governments of our global competitors, placing the U.S. at a competitive disadvantage in attracting new construction of semiconductor manufacturing facilities, or “fabs.” Additionally, federal investment in semiconductor research has been flat as a share of GDP, while other governments have invested substantially in research initiatives to strengthen their own semiconductor capabilities, and existing U.S. tax incentives for R&D lag those of other countries.
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EMAC Returns with Bright Electronics Manufacturing Challenge 2026
04/30/2026 | SMTAThe Electronics Manufacturing & Assembly Collaborative (EMAC) has announced the return of the Bright Electronics Manufacturing Challenge 2026, an immersive, hands-on student competition that puts real electronics manufacturing experience into the hands of the next generation of engineers.
Zhen Ding, Tsinghua University Launch Phase II R&D and Digital Transformation Program
04/30/2026 | Zhen DingZhen Ding Technology Holding Limited, a global leader in the PCB industry, held the launch ceremony for the Phase II (2026-2030) Industry-Academia Collaboration Program of the Zhen Ding-Tsinghua Joint Research Center at the Zhen Ding Technology Lecture Hall on the Tsinghua University campus.
SCHMID Launches 'Any Layer ET' for Panel-Level Advances Packaging, to Present at ECTC 2026
04/30/2026 | SCHMID GroupSCHMID Group, a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its proprietary Any Layer ET (Embedded Trace) Process for full panel-level Advanced Packaging.
Hon Hai, Mitsubishi Electric Exploring Automotive Equipment Business in MOU
04/29/2026 | Hon Hai Precision Industry Co., Ltd.Hon Hai Precision Industry Co. Ltd. (Foxconn) and Mitsubishi Electric Corporation have signed a Memorandum of Understanding to explore a strategic alliance through joint operation of the automotive equipment business.
SEMIEXPO Heartland 2026 Highlights Automotive Electronics and Smart Manufacturing Innovation
04/29/2026 | SEMIThe second edition of SEMIEXPO Heartland opens this week, April 29-30 at the Detroit Marriot at the Renaissance Center in Detroit, Michigan, centered around smart manufacturing, automotive electronics, and workforce development.