-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
IPC Acquires Media Company I-Connect007, Strengthening Relationship to Drive Growth and Innovation in the Electronics Industry
July 28, 2022 | IPCEstimated reading time: 2 minutes

IPC, a global electronics manufacturing industry association, has acquired media company I-Connect007, a global source for news and original content serving the printed circuit design, fabrication, and assembly/EMS markets.
“Acquiring I-Connect007 supports and advances our mission at IPC, which is to help the entire electronics manufacturing supply chain build electronics better,” said Dr. John W. Mitchell, IPC president and CEO. “I-Connect007’s talent, industry knowledge and wealth of publishing experience enhances IPC’s support of the electronics industry. We’re thrilled to take our long-lasting relationship with I-Connect007 to the next level and are committed to helping I-Connect007 further grow their readership globally and reach a wider audience.”
IPC and I-Connect007 have successfully worked together for nearly 20 years. Through this new partnership, I-Connect007 will maintain its journalistic independence while becoming a subsidiary of IPC. The media company’s monthly branded magazines, daily and weekly newsletters, books, special editions and exclusive event coverage will continue to ensure the delivery of timely, need-to-know industry news and information along with in-depth original content.
“IPC shares our steadfast commitment to advancing the industry by delivering the information industry professionals need to drive the growth of the electronics market,” said Barry Matties, co-founder of I-Connect007. “I, along with I-Connect007 staff, am excited to join the IPC team. I will continue to oversee editorial direction to ensure readers and advertisers enjoy the same great value we’ve provided for more than 20 years.”
“The combination of IPC and I-Connect007 paves the way for growth globally and continued investments in new products and services to better serve the electronics industry and provide more value for IPC members,” added Dr. Mitchell.
For the latest industry news and original content from I-Connect007, visit http://iconnect007.com. For more information about IPC, visit www.IPC.org.
About IPC
IPC (www.IPC.org) is a global, not-for-profit industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its nearly 3,000 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly, and testing. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry.
About I-Connect007
I-Connect007 is the industry's longest-running media company and leading publisher of original, exclusive content for the global electronics industry. Our mission is to create original content, distribute pertinent industry news and information, and expand readers' knowledge to help them improve their businesses. I-Connect007 seeks to provide a variety of digital content to suit the needs of our reader community presented by industry sector in the form of magazines, newsletters, articles, eBooks, interviews, market reports, event coverage, and breaking news stories—all available free by becoming a my I-Connect007 member.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
A.R.T. Invests in Latest Equipment to Further Enhance Electronics Training Facilities
09/17/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, has announced a series of new equipment investments at its state-of-the-art training centre.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.