-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueMechatronics
Our expert contributors discuss the advent of mechatronics in PCB design, the challenges and opportunities this creates for circuit board designers, and the benefits—to the employee and the company—of becoming a mechatronics engineer.
Creating a Culture of Collaboration
PCB designers could learn quite a bit from NASA and the private companies that develop spacecraft: Every one of these vehicles is a testament to the value of collaboration among disparate stakeholders. Without a collaborative culture, the rocket might never get off the ground.
Breaking High-speed Material Constraints
Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems. Learn more in this issue.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Excerpt: 'The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2'
August 2, 2022 | Didier Mauve and Robert Art, VentecEstimated reading time: 1 minute
![](https://iconnect007.com/application/files/8616/9086/9852/ventec_book_300.jpg)
Introduction
The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, by Didier Mauve and Robert Art of Ventec International Group is the second in a two-part series. This book builds on the material presented in the first by describing up-to-the-minute products and design techniques for thermal management with IMS.
The first volume comprehensively covers principles of heat transfer and modeling of thermal systems to help engineers quantify the thermal-management challenges in the application at hand, the nature of IMS, typical material parameters, and the choices available for designers to reach the desired performance.
We recommend reading the first book in order to understand the issue from first principles, how to navigate the many material choices offered, and appreciate how adjusting the various combinations of material types and thicknesses can help you arrive at a solution that meets your requirements from all standpoints, particularly system reliability, size, cost, and manufacturability.
The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, covers additional use cases and materials, including those used for high-temperature applications as well as high-emissivity surface treatment that can significantly enhance thermal performance. A web-based thermal calculator is demonstrated, which helps arrive at the exact size of baseplate needed to achieve the desired thermal performance in the smallest possible volume—much smaller than would be possible using a suitably sized heatsink.
Volume 2 delves deeper into issues such as test methods and how these can affect assessments of IMS materials and analyzes the effects of tolerances in material properties and thickness on the overall thermal conductivity. Understanding this can critically influence measurement error, ultimately determining whether or not an accurate result for reliability can be calculated. The authors look at how problems such as solder cracks affect thermal performance, and share application examples showing design with multilayer IMS.
As application challenges have evolved, and new component types and thermal materials have entered the market, there is more to say about thermal management and the options available to designers striving for an effective, economical, and compact solution to meet system-reliability targets.
To continue reading this book from the I-007eBooks library, download it today!
Suggested Items
Altus Highlights Success of Essemtec's I2S in the UK and Ireland Market
07/23/2024 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics industry in the UK and Ireland, is pleased to highlight the success of Essemtec's Integrated Inspection System (I2S).
Automatic Paste Transfer and Quick Change Squeegee for ASMPT Printers
07/23/2024 | ASMPTASMPT, the market and innovation leader in SMT manufacturing technology, has added two new features to its proven DEK printing platforms that automate solder paste transfers and simplify squeegee changes.
New Breakthrough in Double-Sided Reflow Part Retention from Alltemated
07/19/2024 | AlltematedAlltemated's PLACE-N-BOND™ underfilm passed testing and was implemented in volume production to aid in component retention during the second pass reflow of printed circuit assemblies. This successful testing and implementation occurred in various applications with components such as capacitors, inductors, transformers, connectors, and larger ICs.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 2
07/17/2024 | I-Connect007 Editorial TeamIn this chapter, we’ll focus on the most important analytics at the forefront of SMT, from the solder paste machine to placement machines, and breakdown these metrics from the perspectives of the different decision makers involved in the process. The lead SMT shift manager isn’t going to have the same concerns as a quality manager, so it’s important to look at how each machine and operation contains valuable KPIs for each role.
SMTA Heartland Chapter Announces Rescheduled Date for High Reliability: Virtual STAR Forum
07/10/2024 | SMTAThe SMTA Heartland Chapter announces the rescheduled date for the High Reliability: Virtual STAR Forum, following the overwhelming success of our May event. Join us on Tuesday, July 30, 2024, for an afternoon of engaging discussions and expert insights into high-reliability manufacturing.