Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
August 5, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
By now, you have probably heard that I-Connect007 has joined forces with IPC; Andy Shaughnessy led with that news in his Top 5 last week. I-Connect007 is constantly the source of news in the industry, but it’s not often that we’re the subject of the news. This week, it’s a different story.
To top it off, this week has been particularly newsy. So, I’m making the executive decision to include the merger news item as a piece of bonus news. If you haven’t read the July 28, 2022 press release by now, you’re getting another chance to find it here:
The Top 5 list this week contains industry analysis from IPC’s Shawn DuBravac, news on the passage of the U.S. “CHIPS Plus” bill, new materials from Ventec, and a chemistry company completing their acquisition, plus a brand new book in the I-Connect007 eBooks series.
We’ll see you next week, and for many weeks to come (we promise!)
'CHIPS Plus' Bill Passed with IPC’s Active Support
Published August 2
From the press release, this passage jumps out, “IPC advocated strongly for the passage of legislation that would fund the CHIPS Act and urged Congress to include $2.5 billion in the first fiscal year for the National Advanced Packaging Manufacturing Program. IPC applauds both the Senate and the House for reaching an agreement and sending the bill to the President’s desk.” Click through here to read all the particulars and see the high-level numbers associated with CHIPS Plus.
Q4 Concerns: Hold on to Your Hats
Published August 3
With our industry booming, even as we face inflation, rising interest rates, and a worker shortage so acute it might be slowing company growth, and a potential economic recession on the horizon, the signals are decidedly mixed. I-Connect007 talks with IPC Chief Economist Shawn DuBravac, looking ahead to the end of the year. DuBravac does his best crystal ball reading to tell us what to expect.
Ventec Expands Flex-rigid Material Range for Critical Military, Aerospace, and Ultra-high Reliability Applications
Published August 2
The new materials from Ventec include a flex-rigid No Flow / Low Flow prepreg range – tec-speed 4.0 (VT-462(L) PP NF/LF), offering high-Tg, low Dk, low loss, and excellent thermal reliability, designed for military, aerospace/space, and other ultra-high reliability applications. Get a sense for the specification details here.
New Book from I-Connect007 Examines Evolution of Electronics Industry NPI
Published August 1
In “The Electronics Industry’s Guide to…The Evolving PCB NPI Process,” Siemens topic experts Mark Laing and Jeremy Schitter offer a timely look at how the slowdown of production and delivery of materials and components in recent years has impacted the NPI process in the global marketplace. Check it out.
MKS Instruments, Atotech Receive China Antitrust Clearance for Pending Acquisition of Atotech
Published July 29
Mergers and acquisitions continue. MKS Instruments and Atotech “have received unconditional merger approval from China’s State Administration for Market Regulation for MKS’ pending acquisition of Atotech. The transaction has now received all required regulatory clearances.” Now is the time for making acquisitions.
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