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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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IPC Issues Call for Participation: Help Shape the Future of Design for Environment StandardsAugust 22, 2022 | IPC
Estimated reading time: 1 minute
IPC’s Design for Excellence (DFX) guidelines document, IPC-2231 provides a framework to establish a design review process for the layout of printed board assemblies. This design review assesses the manufacturability attributes of printed boards, namely design for manufacturing, fabrication, assembly, testability, cost, reliability, environment, and reusability. IPC is aware of the responsibilities that electronics manufacturing companies will soon have to regulatory bodies around the world as well to the environment.
IPC’s 1-14 DFX Committee is actively reviewing IPC-2231A in order to revise it within the next two years. While a revision of the DFX guidelines document is IPC’s and the standards committee’s first priority, the team anticipates that they may be able to expand IPC eco-design activities to include the creation of a new eco-design for electronics guideline that provides a holistic coverage of circularity concepts and how they touch every step of the electronics manufacturing pipeline.
“We feel that this is an excellent opportunity to make a real difference in eco-design for circular electronics – but it all starts with the IPC-2231 DFX guidelines document,” said Patrick Crawford, IPC manager for design standards and related industry programs and IPC staff liaison to the 1-14 DFX Committee. “While IPC is determined to help electronics manufacturing companies become greener themselves, it will take continued input from industry through standards development activities through organizations like IPC, to produce meaningful change.”
Experts in green PCB design techniques, materials, manufacturing technologies, sourcing, policy, and regulation are invited to create the next standard for design for environment. If you have expertise or passion to create a greener future that benefits both industry and environment and want to contribute to establishing a best practice design methodology, please reach out to Patrick Crawford at PatrickCrawford@ipc.org.
DuPont today announced that Jon Kemp, President, DuPont Electronics & Industrial, has been named Chair of the Board of Industry Leaders of SEMI, a global industry association serving the electronics design and manufacturing supply chain.
With the seemingly endless ways that electronic products are worming their way into our lives, what was once “nice to own” is increasingly considered indispensable. The capabilities of these products have been driven by relentless improvements at every level of the manufacturing chain, from individual transistors (which are approaching Angstrom levels) to systems the size of buildings supporting Bitcoin mining and increasingly distributed AI products.
HARMAN, an automotive electronics technology company and subsidiary of Samsung Electronics Co., Ltd. focused on delivering consumer experiences at automotive grade, confirms it will continue as an Official partner of Scuderia Ferrari for a second Formula One season. The on-track marketing partnership extends to technology on the road, with Ferrari becoming the first automotive OEM to adopt a number of solutions from HARMAN’s in-cabin monitoring system, HARMAN Ready Care, for its next-generation road cars.
Maggie Benson was in an expansive mood. It had been almost three years since her grandfather asked her to take over Benson Electronics. By using Lean techniques, cost modeling the assembly process, and implementing continuous improvement, the company made significant profitability improvements.
I-Connect007 is excited to announce the latest season of its popular podcast, On the Line With..., where industry experts share the latest insights and perspectives on the most relevant topics in the electronics industry. In this new season, “PCB 3.0: A New Design Methodology,” host Nolan Johnson speaks with Cadence experts about the shift taking place in the methods used for designing circuit boards. In this first episode, Product Management Director Patrick Davis addresses the need for change.