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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Modelithics Introduces EMA Design Automation as Modelithics Reseller
August 23, 2022 | EMA Design AutomationEstimated reading time: 1 minute
Modelithics, the industry leader in providing innovative and high-quality custom modeling and measurement services for RF, microwave and millimeter-wave electronic devices is pleased to introduce EMA Design Automation, Inc. (EMA) the world's largest ECAD VAR, as a Modelithics Reseller.
“We are seeing dramatic growth in RF and microwave design content from our customers across the globe,” said Manny Marcano, President of EMA. “Partnering with Modelithics will allow us to provide our customers a plug-n-play solution to help them accelerate their RF analysis and ensure they are able to achieve first pass success for these critical RF systems and subsystems.”
As a reseller of Modelithics, EMA will be able to meet the needs of design engineers globally by offering high-accuracy RF and microwave active and passive simulation models for Modelithics' premium product the Modelithics COMPLETE Library, which includes models, representing more than 25,000 components from over 70 component and IC vendors. Also available is the mmWave & 5G Library, System Components LibraryT and the COMPLETE+3D Library. The COMPLETE+3D Library includes Modelithics extension collection of CLR component models, plus over 500 3D Geometry models. In addition, EMA will be representing Modelithics' broad array of highest quality, RF/microwave/mm-wave Characterization and Modeling services, including Modelithics' world-class GaN modeling and 3D modeling capabilities.
“We welcome this new sales channel partnership with EMA as we bring together very complementary strengths for the benefit of our mutual customers,” said Larry Dunleavy, President and CEO of Modelithics.
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A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.
Zuken Launches GENESYS 2026 to Broaden Access and Improve MBSE Workflows
04/28/2026 | ZukenZuken announced GENESYS 2026, the latest version of its model-based systems engineering platform, with updates designed to improve performance, expand access to model-based information, and enhance the day-to-day modeling experience for engineering teams.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
Cadence Reports Q1 2026 Financial Results
04/28/2026 | Cadence Design SystemsCadence had a strong start to 2026, delivering a solid Q1 with accelerating AI demand and record backlog, reflecting strong customer commitment to our AI-driven portfolio,” said Anirudh Devgan, president and chief executive officer.
Tomachie Launches AI-Powered PCB Analysis with Smart Test Point Insertion
04/28/2026 | TomachieTomachie announced its AI-Assisted PCB schematic design analysis platform, enabling engineering teams to evaluate and improve schematic quality before layout begins. Schematic errors caught after layout — or in production — cost 10 to 100 times more to fix than those caught during schematic capture.