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A Designer's Focus on High Density

04/30/2026 | Marcy LaRont, I-Connect007 Magazine
Vern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.

Zuken Launches GENESYS 2026 to Broaden Access and Improve MBSE Workflows

04/28/2026 | Zuken
Zuken announced GENESYS 2026, the latest version of its model-based systems engineering platform, with updates designed to improve performance, expand access to model-based information, and enhance the day-to-day modeling experience for engineering teams.

EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space

04/28/2026 | ECIO
Every chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?

Cadence Reports Q1 2026 Financial Results

04/28/2026 | Cadence Design Systems
Cadence had a strong start to 2026, delivering a solid Q1 with accelerating AI demand and record backlog, reflecting strong customer commitment to our AI-driven portfolio,” said Anirudh Devgan, president and chief executive officer.

Tomachie Launches AI-Powered PCB Analysis with Smart Test Point Insertion

04/28/2026 | Tomachie
Tomachie announced its AI-Assisted PCB schematic design analysis platform, enabling engineering teams to evaluate and improve schematic quality before layout begins. Schematic errors caught after layout — or in production — cost 10 to 100 times more to fix than those caught during schematic capture.
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