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Trackwise Designs Awarded Cyber Essentials Plus Accreditation
August 25, 2022 | TrackwiseEstimated reading time: Less than a minute

Trackwise is delighted to have been awarded the Cyber Essentials Plus accreditation, the Government’s enhanced cyber security recognition, for the 7th consecutive year.
The Cyber Essentials scheme was launched in 2014 and is designed to help UK businesses protect themselves against the threat of cyber attack. It offers verifiable certification that Trackwise has achieved the more advanced of the two Cyber Essentials certifications– a tier scheme, requiring external audit and 100% compliance against stringent process and systems criteria.
Managing Director Philip Johnston commented, “with the ongoing risk of high profile global cyber security breaches, everyone needs to be as careful as possible. All parts of the Trackwise group of companies take these issues very seriously, and in once again achieving this accreditation we hope to give our customers, supplier and employees the assurance that, as always, we are totally committed to ensuring the security and protection of their data and of our IT systems and business operations.”
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India’s Aerospace and Defence Engineered for Power, Driven by Electronics
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VIDEOTON EAS's Bulgarian Subsidiary Expands Into Automotive Products
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Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
09/15/2025 | HanwhaHanwha Aerospace has signed a contract with BAE Systems to integrate next-generation, anti-jamming Global Positioning System (GPS) technology into Hanwha Aerospace’s Deep Strike Capability precision-guided weapon system.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).