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Saki Launches Next-Generation 3Si/3Di-EX Series for SPI & AOI

02/12/2025 | Saki Corporation
Saki Corporation, a global leader in automated inspection solutions, proudly announces the launch of its latest 3Si/3Di-EX Series of 3D Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) systems, set to begin shipping in April 2025.

MACOM European Semiconductor Center (MESC) Awarded Contract

02/12/2025 | MACOM
MACOM Technology Solutions Inc. (MACOM) is pleased to announce that its France-based European Semiconductor Center (MESC), has been awarded a multi-year contract from Banque Publique d'Investissement (BPI) to lead the development and manufacturing of advanced semiconductor products, in collaboration with public and private sector partners.

Laser Photonics Secures Repeat Bruce Power Order for Advanced CleanTech Laser Technology

02/11/2025 | BUSINESS WIRE
Laser Photonics Corporation (LPC), a leading global developer of industrial laser systems for cleaning and other material processing applications, announced that it has received an order for a second and third CleanTech 500-CTHD laser cleaning system from Sargent & Lundy for use by Bruce Power in Ontario, Canada, the operator of North America’s largest operational nuclear power plant.

L3Harris Launches New Technology to Control Autonomous Swarms

02/11/2025 | BUSINESS WIRE
L3Harris Technologies has introduced AMORPHOUS™, its new software that features a single user interface to operate thousands of autonomous assets simultaneously.

Rehm Thermal Systems Brings Pioneering Manufacturing Technologies to productronica China 2025

02/11/2025 | Rehm Thermal Systems
Rehm Thermal Systems will be presenting its further developments in areas such as convection soldering under vacuum, condensation soldering, coating and dispensing in Hall E4 of the Shanghai New International Expo Centre from 26 to 28 March.
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