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Atotech to Participate at KPCA 2022
September 8, 2022 | AtotechEstimated reading time: 1 minute
Atotech, MKS’ globally leading brand in surface-finishing solutions announced to take part at this year’s KPCA Show to be held at Songdo Convensia, Incheon, Korea, from September 21-23. Experts from MKS’ Atotech and MKS’ ESI brands will be available to discuss latest industry trends and challenges, as well as introduce the new combined product offering consisting of PCB production equipment (wet-to-wet process equipment, laser systems, and auxiliaries), chemistry, software, and service. The company will be exhibiting at booth: #G201 with the following products on display:
Flex PCB production using UV laser
- Innerlayer treatment & lamination: BondFilm® Series and CupraEtch®Series
- Cu thinning: HyperEtch®
- Via formation: CapstoneTM, 5535TM, RedStoneTM, LodeStoneTM, RedStoneXPTM
- Primary metallization: ViaKing® Series, Neoganth® Activation and Printoganth®
- E’less Cu combined with Uniplate® LB / Polygon platform
- Via Plate/Fill: Inpusle® Series combined with Uniplate® Cu, InPro® Series combined with V-Plate® platform; Cupracid® Series
HDI PCB production using CO2 laser
- Innerlayer treatment & lamination: BondFilm® and CupraEtch® combined with Horizon® platform
- Cu thinning: HyperEtch®
- Laser pretreatment: BondFilm®LDD combined with Horizon® platform
- Via formation: GeodeTM
- Laser post-treatment: BondFilm®LDD SR combined with Horizon® / Polygon platform
- Primary metallization: Securiganth®Desmear combined with UniPlate® P, Neoganth® Activator and Printoganth® E’less Cu combined with Uniplate® LB
- Via Plate/Fill: Inpusle® Series combined with Uniplate® Cu, InPro® Series combined with V-Plate® platform; Cupracid® Series
IC Packaging production using CO2 laser
- Innerlayer treatment & lamination: NovaBond® Series
- Via formation: GeodeTM A
- Primary metallization: Securiganth®Desmear combined with UniPlate® P, Neoganth® Activator and Printoganth® E’less Cu combined with Uniplate® LB
- Image: AdHere® Series and Imagine DS
- Via Plate/Fill: Inpusle® Series combined with Uniplate® Cu, InPro® Series combined with V-Plate® platform
- Strip and Etch: ResistStrip ® Series, EcoFlash®, Hyperflash®, PallaStrip®
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