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DuPont Pyralux AP to Aid Reliable Performance of Semikron-Danfoss eMPack Modules Powering Next-Gen EV
September 22, 2022 | DuPontEstimated reading time: 1 minute
DuPont Interconnect Solutions, part of the Electronics & Industrial business, announced a multiyear contract with European power module manufacturer Semikron-Danfoss who will integrate DuPont™ Pyralux® AP all-polyimide double-sided copper clad laminate into its eMPack® power modules to further enhance the capabilities of next-gen electric vehicles.
Integrating Pyralux® AP copper clad laminate into eMPack® traction inverter designs will help EV automotive engineers address key requirements related to signal integrity and power transmission. The characteristics of Pyralux® AP benefiting this application from Semikron-Danfoss include:
- Robust thermal resistance for temperature stability
- All-polyimide dielectric layer
- Extreme durability
- Excellent bond strength for automotive-grade reliability
- Excellent low dissipation loss characteristics
- Superior electrical performance
- Consistent signal integrity
Further, Pyralux® AP’s dielectric thickness tolerance and low coefficient of thermal expansion make it ideal for rigid flex or multiple layer flex applications. The adhesive-less flexible circuit material has a flammability rating of UL 94-V0, a maximum operating temperature of 200°C, and is certified to IPC 4204A/11.
"Pyralux® AP emerged as our best-fit solution after extensive testing and because the product has demonstrated three decades of stable, reliable performance in a variety of industries where operating conditions, like ours, are severe,” said Karl-Heinz Gaubatz, CTO of Semikron. “eMPack® is a perfect fit to SiC MOSFET power modules. We look forward to working with DuPont and their Pyralux® technology to help eMPack® become a global leader in EV power modules.”
Earlier this year, Semikron-Danfoss, headquartered in Nuremburg, Germany, won a billion-Euro contract beginning in 2025 to furnish patented eMPack® power modules to a major German automotive manufacturer. Within silicon-carbide MOSFET or full silicon-carbide technology-based modules, traction inverters can be created which are extremely compact, scalable, and reliable because of a Semikron double side sintered assembly and connection technology called Direct Pressed Die (DPD).
“We are excited how this EV power module application of Pyralux® AP copper clad laminate supports a sustainable and electrified future to help preserve our planet for generations to come,” said Andy Kannurpatti, Global Business Director, Films & Laminates, DuPont Interconnect Solutions. “The eMPack® power module is expected to enable millions of next-gen electric vehicles by 2032. We look forward to contributing significantly to the much-anticipated success of eMPack® and appreciate the collaboration with Semikron-Danfoss.”
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