-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAlternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
American Standard Circuits to Exhibit at SMTA Empire Expo & Tech Forum
September 22, 2022 | American Standard CircuitsEstimated reading time: Less than a minute
Printed circuit board fabricator, American Standard Circuits will be exhibiting at this year's SMTA Empire Expo & Tech Forum. The event is scheduled for Tuesday, September 27th, 2022 at the RIT Inn & Conference Center, beginning at 9 AM.
The event will include free technical sessions, free lunch and the chance to network with leading suppliers to our industry.
Be sure to visit ASC on the show floor to speak with their technology experts about your next project.
Check out this educational content from American Standard Circuits:
- The Printed Circuit Designer’s Guide to…?Fundamentals of RF/Microwave PCBs
- The Printed Circuit Designer’s Guide to… Flex and Rigid-Flex Fundamentals
- The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator’s Perspective
- RealTime with… American Standard Circuits, three discussions: flex and rigid flex PCBs by Anaya Vardya and Dave Lackey; RF/microwave PCBS by Anaya Vardya and John Bushie; and thermal management by Anaya Vardya, John Bushie, and Dave Lackey
- You can also view other titles in our full I-007eBooks library.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/08/2024 | Nolan Johnson, I-Connect007In our industry we work on solutions. This week, solutions are represented in these must-read choices. Solid state batteries make an appearance, as does LED imaging equipment at American Standard Circuits. SPEA’s AI-based optical inspection is here, as are Happy Holden’s recent article on one key engineering skill and news about a flagship R&D facility funded by the U.S. CHIPS Act.
PCB Designers: Enhance Your Listening Experience With New Companion Download to the DFR Podcast Series
11/07/2024 | I-Connect007Exciting news for listeners of On the Line With... Designing for Reality, the popular podcast series hosted by I-Connect007. A 10-page companion guide featuring insights from ASC Sunstone’s expert Matt Stevenson is now available for download.
CEE PCB to Exhibit at Electronica 2024
10/31/2024 | CEE PCBTom Yang, CEO of CEE PCB, has announced that his company will be exhibiting at this year’s electronica 2024 to be held in Munich, Germany from November 12th through the 15th at the Trade Faire Center Messe München.
Flexible Thinking: Musings on High Density Interconnections
10/30/2024 | Joe Fjelstad -- Column: Flexible ThinkingPeople have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.
Highlights of the ICT 50th Anniversary Symposium
10/24/2024 | Pete Starkey, I-Connect007Why does it always rain when I attend these events? Temperatures were dropping, daylight was shrinking, and there were seasonal colour changes in wet hedgerows as I travelled to Gloucestershire for the 50th Anniversary Symposium of the Institute of Circuit Technology at Puckrup Hall near Tewkesbury in mid-October. It was a memorable occasion: Nostalgic for my contemporaries who remembered our industry at its most prosperous, technically outstanding in the quality and significance of presentations to an attentive audience of printed circuit professionals, and complemented by the sharing of ideas, information, and trade gossip within a friendly community at the evening gathering.