-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLearning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Dr. Giovanni De Micheli Honored with 2022 Phil Kaufman Award Presented by ESD Alliance and IEEE CEDA
September 29, 2022 | SEMIEstimated reading time: 2 minutes

Dr. Giovanni De Micheli, Professor and Director of the Institute of Electrical Engineering (IEL) and of the Integrated Systems Centre at the École Polytechnique Fédérale de Lausanne (EPFL) in Lausanne, Switzerland, has been honored with the 2022 Phil Kaufman Award for Distinguished Contributions to Electronic System Design. The award is presented annually by the Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, and the Institute of Electrical and Electronics Engineers (IEEE) Council on Electronic Design Automation (CEDA).
Dr. De Micheli was recognized for his extensive contributions to electronic design automation (EDA). His EDA tools and methodologies research has helped drive significant advances in the academic field of design automation and made a lasting impact on the industry through their incorporation into commercial EDA solutions. Notably, he developed multiple technologies while inspiring his students, university researchers and engineers in the industry. His work has expanded the fields of high-level synthesis, logic synthesis, and Network-on-Chip (NoC) for more than 30 years.
“Professor De Micheli, or Nanni to many of us who’ve been driving our industry forward for decades, stands as a relentless advocate for our field,” said Aart de Geus, Chairman and CEO of Synopsys. “While many predicted our industry was fully matured, he remained focused and creative, be it with the encoding of finite-state machines combined with logic minimization or solving the cell-library mapping problem with Boolean matching. I am not alone when I express my appreciation to Nanni for advancing the field, but most important, for continuing to add findings that keep our profession fresh and exciting!”
“For the over three decades that I have known Professor De Micheli, he has established himself as a true force in the EDA community,” said Dr. Patrick Groeneveld, past chair of the Design Automation Conference (DAC). “His key technical contributions lie in the areas of logic synthesis, hardware software co-design, NoC design and physical synthesis.”
“Dr. De Micheli has been a stalwart innovator and supporter of EDA with numerous and lasting contributions, and certainly he well deserves this honor,” said Gi-Joon Nam, President of the IEEE Council on EDA.
“On behalf of the ESD Alliance, I congratulate Professor De Micheli on receiving the 2022 Phil Kaufman award,” said Simon Segars, ESD Alliance Chairman. “The industry would not be where it is today without his groundbreaking research, which was often years ahead of its time. His impact on the industry is well-recognized and celebrated with this distinguished award.”
Suggested Items
Intel Appoints Lip-Bu Tan as Chief Executive Officer
03/13/2025 | Intel CorporationIntel Corporation announced that its board of directors has appointed Lip-Bu Tan, an accomplished technology leader with deep semiconductor industry experience, as chief executive officer, effective March 18.
IMAPS and DPC: 21 Years of Elevating Technical Knowledge
03/13/2025 | Marcy LaRont, I-Connect007The IMAPS 21st Device Packaging Conference (DPC) may have taken place at a conference center located down an idyllic desert road showcasing the best of what native Arizona has to offer, but the topics at this conference were anything but laid-back. This important platform for professionals in microelectronics and advanced packaging set the stage for a technology in high demand. Brian Schieman, IMAPS executive director, says the show was organized to demonstrate their commitment to addressing current technological trends and with significant energy directed toward fostering connections within the supply chain.
KYZEN Announces the Retirement of Longtime Executive Vice President Tom Forsythe
03/13/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, announces the retirement of Tom Forsythe, Executive Vice President, effective December 31, 2024, after more than three decades of service to the company and the electronics manufacturing industry.
Technica USA Celebrates 40 Years of Excellence in Electronics Manufacturing
03/13/2025 | Technica USATechnica USA, a leading provider of materials, equipment, installation, and services for the printed circuit board (PCB) fabrication, PCB Assembly, substrates, MEMS, and semiconductor industries, proudly announces its 40th anniversary in 2025.
IPC Asia’s Talent Development Program Opens Pathways to a More Qualified Workforce
03/14/2025 | Evelyn Cui, IPC AsiaIn Asia, the contradiction between the rapid development of the electronics manufacturing industry and the shortage of talent is particularly evident. The existing talent pool cannot fully meet the market's demand for highly skilled professionals. According to feedback from industry companies, there is an urgent need for professionals with knowledge of IPC standards and practical skills in electronics. However, the reality is that most academic courses are disconnected from the actual needs of the industry, leading to disappointing results when companies recruit from universities and schools.