Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
SIA Applauds Appointment of Industry Leaders to Advise Commerce Department on CHIPS R&D Implementation
September 30, 2022 | SIAEstimated reading time: 2 minutes
The Semiconductor Industry Association (SIA) released the following statement from President and CEO John Neuffer commending the U.S. Commerce Department’s appointment of an Industrial Advisory Committee (IAC) to provide guidance to the Secretary of Commerce on a range of issues related to domestic semiconductor research and development in support of the CHIPS for America Act. The newly appointed IAC members include representatives from across the semiconductor industry and the broader microelectronics ecosystem.
“Enactment of the CHIPS Act was an historic win for the semiconductor industry and American innovation, economic growth, and national security. To realize the full benefits of the CHIPS Act’s R&D investments, it is critical for government, industry, and academia to work collaboratively to ensure the new funding bridges key gaps in the current semiconductor R&D ecosystem.
“The newly appointed Industrial Advisory Committee is a significant step toward ensuring the CHIPS Act turbocharges U.S. semiconductor innovation for many years to come. We applaud the appointment of these highly accomplished industry leaders and look forward to continuing to work with government officials to ensure the CHIPS Act is implemented effectively and efficiently.”
The newly appointed members include:
- Mike Splinter (Chair), General Partner, MRS Business and Technology Advisors
- Susan Feindt (Vice-Chair), Director of Advanced Process Development Group, Analog Devices
- James Ang, Chief Scientist, Pacific Northwest National Laboratory
- Daniel Armbrust, Founder/Chief Executive Officer, Silicon Catalyst
- Susie Armstrong, Senior Vice President of Engineering, Qualcomm
- Ahmad Bahai, Chief Technology Officer, Texas Instruments
- Bill Chappell, Vice President of Technology, Microsoft
- Michael Fritze, Vice President of Microelectronics Policy, Potomac Institute for Policy Studies
- Charles Gray, Vice President of Digital Systems Technology, Ford Motor Company
- Carol Handwerker, Reinhardt Schuhmann, Jr. Professor of Materials Engineering & Professor of Environmental and Ecological Engineering, Purdue University
- Deirdre Hanford, Chief Security Officer, Synopsys
- Rajarao Jammy, Chief Technology Officer, MITRE Engenuity
- Ken Joyce, Executive Vice President, Brewer Science
- Ann Kelleher, Executive Vice President of Tech Development, Intel Corporation
- Mukesh Khare, Vice President, IBM Research
- Meredith LaBeau, Chief Technology Officer, Calumet Electronics
- Tsu-Jae King Liu, Dean of the College of Engineering, University of California Berkley
- Om Nalamasu, Chief Technology Officer, Applied Materials
- Debo Olaosebikan, CEO and Founder, Kepler Computing
- Alex Oscilowski, President, TEL America
- Willy Shih, Robert and Jane Cizik Professor of Management Practice in Business Administration, Harvard Business School
- Brandon Tucker, Chief Workforce Development Officer, Washtenaw Community College
- S. Philip Wong, Willard R. and Inez Kerr Bell Professor in the School of Engineering, Stanford University
- Anthony Yen, Vice President of Technology and Director of ASML Technology Center
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/22/2024 | Andy Shaughnessy, I-Connect007In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!
Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association
11/22/2024 | SIAThe Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
Meet Polar's New Product Specialist Jess Hollenbaugh
11/21/2024 | Andy Shaughnessy, I-Connect007At PCB West, I spoke with Jess Hollenbaugh, a recent college graduate who has now joined Polar Instruments. In this interview, she shares her journey from a physics student focused on high-energy astrophysics to her new role at Polar. Her insights provide a glimpse into the dynamic opportunities awaiting those who venture into this evolving industry.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.