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American Standard Circuits to Exhibit at PCB West 2022
October 3, 2022 | American Standard CircuitsEstimated reading time: Less than a minute
American Standard Circuits will be exhibiting at the 2022 PCB West show on Wednesday, Oct. 5 at the Santa Clara Convention Center.
American Standard Circuits president and CEO Anaya Vardya stated, “Silicon Valley is a target rich area with lots of opportunity to talk with so many PCB designers. As we grow, nearing $50 million this year, we continue our involvement with a great deal of cutting-edge technology which means working closely with designers on their products of the future. PCB West is certainly the best show for this.”
Be sure to visit American Standard Circuits on the show floor in booth #616.
Check out this educational content from American Standard Circuits:
- The Printed Circuit Designer’s Guide to…?Fundamentals of RF/Microwave PCBs
- The Printed Circuit Designer’s Guide to… Flex and Rigid-Flex Fundamentals
- The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator’s Perspective
- RealTime with… American Standard Circuits, three discussions: flex and rigid flex PCBs by Anaya Vardya and Dave Lackey; RF/microwave PCBS by Anaya Vardya and John Bushie; and thermal management by Anaya Vardya, John Bushie, and Dave Lackey
- You can also view other titles in our full I-007eBooks library.
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Brent Fischthal - Koh YoungSuggested Items
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11/06/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for printed circuit board assembly and advanced packaging at Productronica 2025, joining their longstanding distribution partners Amtest Group, stand A2.532, and smartTec Gmbh, stand A2.527, as well as in the Future Packaging Hybrid Live Lab, stand B2.261.
GlobalFoundries, Silicon Labs Expand Partnership to Accelerate Wireless Connectivity Solutions and Strengthen U.S. Chip Manufacturing
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Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
On the Line with… Ultra HDI, Episode 8: “Materials, Up and Coming Capabilities,” Now Available
11/05/2025 | I-Connect007I-Connect007 is excited to announce the release of the eighth episode of its 12-part podcast series, On the Line with… American Standard Circuits: Ultra HDI. In this episode, “Materials, Up and Coming Capabilities,” host Nolan Johnson sits down with resident expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to discuss how material selection influences the Ultra HDI (UHDI) manufacturing process.
High Density Packaging User Group Announces ASKPCB Membership
11/03/2025 | HDP User GroupHigh Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.