Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
American Standard Circuits to Exhibit at PCB West 2022
October 3, 2022 | American Standard CircuitsEstimated reading time: Less than a minute
American Standard Circuits will be exhibiting at the 2022 PCB West show on Wednesday, Oct. 5 at the Santa Clara Convention Center.
American Standard Circuits president and CEO Anaya Vardya stated, “Silicon Valley is a target rich area with lots of opportunity to talk with so many PCB designers. As we grow, nearing $50 million this year, we continue our involvement with a great deal of cutting-edge technology which means working closely with designers on their products of the future. PCB West is certainly the best show for this.”
Be sure to visit American Standard Circuits on the show floor in booth #616.
Check out this educational content from American Standard Circuits:
- The Printed Circuit Designer’s Guide to…?Fundamentals of RF/Microwave PCBs
- The Printed Circuit Designer’s Guide to… Flex and Rigid-Flex Fundamentals
- The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator’s Perspective
- RealTime with… American Standard Circuits, three discussions: flex and rigid flex PCBs by Anaya Vardya and Dave Lackey; RF/microwave PCBS by Anaya Vardya and John Bushie; and thermal management by Anaya Vardya, John Bushie, and Dave Lackey
- You can also view other titles in our full I-007eBooks library.
Share on:
Suggested Items
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).
PI's New Expansion for Higher Electronics Manufacturing Capacities and Shorter Lead Times
11/20/2024 | PRNewswirePI, the market and technology leader for high-precision motion control, positioning technology, and piezo applications, has completed the construction of additional electronics production space at its Rosenheim, Germany site.
Advanced Packaging: Preparation is Now
11/20/2024 | Nolan Johnson, SMT007 MagazineA new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.
Cadence Unveils Arm-Based System Chiplet
11/20/2024 | Cadence Design SystemsCadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence's commitment to driving industry-leading solutions through its chiplet architecture and framework.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in