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October 2022 Issue of Design007 Available Now
October 10, 2022 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

It's tough to get much smaller than ultra HDI. This is a whole new level of miniaturization for most PCB designers and fabricators. UHDI folks speak in terms of microns, not mils. And everything changes when you start working with 15-micron lines and spaces.
So, in the October issue of Design007 Magazine, we asked some of the top UHDI experts to share their knowledge about designing and fabricating these tiny features. Join us as we journey to UHDI and beyond!
Download your PDF copy for future reference. Sign up for delivery in your e-mailbox by subscribing here.
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Sweeney Ng - CEE PCBSuggested Items
Global Excellence in PCB Design: The Global Electronics Association Expands to Italy
08/07/2025 | Global Electronics AssociationIn today's rapidly evolving electronics industry, printed circuit boards (PCBs) serve as the critical backbone influencing the success, reliability, and time-to-market of countless products. Recognizing this essential role, the Global Electronics Association (formerly IPC), a worldwide leader in electronics standards, certification, and education, is now expanding its internationally acclaimed PCB design training to Italy.
Driving Innovation: Inner Layer Alignment Methods in PCB Production
08/06/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, precision is a fundamental requirement. Among many complex processes, the accurate registration of inner layers before lamination is one of the most critical. Much like a child's game where rings must be perfectly stacked onto a single pin, PCB manufacturers align multiple conductive and insulating layers to form a cohesive, functional board. This alignment directly affects PCB precision; tighter layer alignment results in smaller "annular rings," superior performance, and higher yields.
Setting Design Constraints Effectively
07/31/2025 | Stephen V. Chavez, Siemens EDAPCB design requires controlling energy within the medium of a PCB. The manner in which we control the chaos of energy is by implementing and utilizing physical and electrical rules, known as constraints, along with a specific structure and material(s) that make up what is known as the foundation of the design. These rules govern everything within the PCB structure and generally fall into two camps: performance and manufacturability. Setting this foundation correctly is extremely important and the key to success.
Considering the Future of Impending Copper Tariffs
07/30/2025 | I-Connect007 Editorial TeamThe Global Electronics Association is alerting industry members that a potential 50% tariff on copper could hit U.S. electronics manufacturers where it hurts.
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
07/09/2025 | Happy Holden -- Column: Happy’s Tech TalkWhen we consider via reliability, the major contributing factors are typically processing deviations. These can be subtle and not always visible. One particularly insightful column was by Mike Carano, “Causes of Plating Voids, Pre-electroless Copper,” where he outlined some of the possible causes of hole defects for both plated through-hole (PTH) and blind vias.