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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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October 2022 Issue of Design007 Available NowOctober 10, 2022 | I-Connect007 Editorial Team
Estimated reading time: Less than a minute
It's tough to get much smaller than ultra HDI. This is a whole new level of miniaturization for most PCB designers and fabricators. UHDI folks speak in terms of microns, not mils. And everything changes when you start working with 15-micron lines and spaces.
So, in the October issue of Design007 Magazine, we asked some of the top UHDI experts to share their knowledge about designing and fabricating these tiny features. Join us as we journey to UHDI and beyond!
One of my great joys as a grandfather of eight is spending time with them at the park. It doesn't take too long until I'm getting stuck on a slide that is too small for me or on the seesaw, with me on one side and them trying to lift me. At that point, they learn some harsh lessons in physics and how heavy Grandpa really is. A seesaw is a relatively simple device, but it’s a great way to explain a rather complex concept in PCB design: design tradeoffs. Each decision made throughout a design comes with inherent pros and cons.
It’s easy to get distracted in an election year. A constant stream of polls, primaries, and political prognostications will surely dominate the media cycle. Elections are important, but they should not distract the 118th Congress from the important work of securing our fragile supply chains and rebuilding microelectronics manufacturing capacity on our own shores.
An important but sometimes overlooked aspect of flex and rigid-flex fabrication and assembly is the flex circuit tail, which is attached to a rigid PCB with pressure-sensitive conductive adhesives. This sub-assembly is becoming very common. We often see this applied to glass displays and microelectronic applications.
What often surprises me when working with contract manufacturers (CMs) is that many of them, especially the ones earning less than $25 million a year, have not done much planning for more business and their futures. I’ve realized that many started to build a specific sub-assembly as offshoots of a larger company.
A new forecast from International Data Corporation (IDC) shows shipments of artificial intelligence (AI) PCs – personal computers with specific system-on-a-chip (SoC) capabilities designed to run generative AI tasks locally – growing from nearly 50 million units in 2024 to more than 167 million in 2027.