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October 2022 Issue of Design007 Available Now
October 10, 2022 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
![](https://iconnect007.com/application/files/4116/9087/0072/Design-1022-cover-250.jpg)
It's tough to get much smaller than ultra HDI. This is a whole new level of miniaturization for most PCB designers and fabricators. UHDI folks speak in terms of microns, not mils. And everything changes when you start working with 15-micron lines and spaces.
So, in the October issue of Design007 Magazine, we asked some of the top UHDI experts to share their knowledge about designing and fabricating these tiny features. Join us as we journey to UHDI and beyond!
Download your PDF copy for future reference. Sign up for delivery in your e-mailbox by subscribing here.
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Don’t Just Survive, Thrive: The July 2024 Issue, PCB007 Magazine
07/18/2024 | I-Connect007 Editorial TeamIf we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. What does it take to remain viable and grow and prosper during so much change? In this issue of PCB007 Magazine, our contributors explore these concepts meant to help you take your business to the next level.
A Great Recipe: Collaboration, Motivation, and Design Classes
07/17/2024 | Andy Shaughnessy, Design007John Watson, CID, is a professor at Palomar College near San Diego. John teaches a basic PCB design class and an advanced class, and graduates from these classes are ready for their first PCB design job. These appear to be the only classes of their kind in the U.S., and as more designers retire, the demand for classes like this will continue to rise. I recently spoke with John and one of his students, Mehdi Kacem, a junior embedded systems engineer intern at Avempace in Tunisia. In this interview, Mehdi explains how his desire to collaborate and his motivation to succeed helped him get the most out of John’s courses.
Indium Corporation Introduces Au-Based Precision Die-Attach Preforms
07/17/2024 | Indium CorporationIndium Corporation® is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of precision to reduce defects, control bondline thickness (BLT), and deliver high-yield performance and reliability in critical die-attach applications.
Trouble in Your Tank: Materials for PWB Fabrication—Drillability and Metallization
07/16/2024 | Michael Carano -- Column: Trouble in Your TankLaminate materials are the building blocks on which printed circuit boards are manufactured. Circuit board designers rely on the critical electrical properties of the materials to design the interconnects, and with the drive toward IoT (internet of things), autonomous driving, and virtual and augmented reality, material properties take on a very high level of importance.