Beyond Design: Radiation and Interference Coupling
Elementary, Mr. Watson: Design Data Packages—Circle of Concern or Circle of Influence?
Fresh PCB Concepts: The Power of a Lunch & Learn for PCB Professionals
Indium Corporation to Deliver Keynote Presentation on e-Mobility at SMTA California Expos
October 11, 2022 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation’s Brian O’Leary, global head of e-Mobility and infrastructure, will deliver the keynote presentation on market trends in the thriving electric vehicle (EV) landscape at the Surface Mount Technology Association’s (SMTA) LA/OC Expo & Tech Forum, at 10:30 a.m. local time, Tuesday, Nov. 15, and Thursday, Nov. 17 in Long Beach and Escondido, Calif., U.S, respectively.
The automotive landscape is changing at a breathtaking speed as start-ups and legacy automotive makers alike pour billions of dollars into electric vehicles (EVs). EVs have been called “computers on wheels” and for good reason, having more than three times the electronics and a fraction of the mechanical parts of an internal combustion engine. Unlike prior technologies that might have started in the United States to only later migrate offshore, EVs are an equal opportunity industry with thriving local manufacturing and a trend to locally source. In e-Mobility: Important Trends to Help Drive Your Business, O’Leary will explore some important trends in the market, such as commercial, technological, and supply chain. Participants should leave with key insights on how they might compete in this exciting and growing industry.
O’Leary is responsible for promoting Indium Corporation’s full range of products and services for e-Mobility, which include the markets for EVs, charging stations, and infrastructure, among others. He joined Indium Corporation in 2014 and has more than 20 years of experience in sales, marketing, and channel management in the electronics industry. He currently serves as the chair of the IPC e-Mobility Quality & Reliability Advisory Group. In addition to regular technical conference participation, Brian co-hosts a free monthly webcast—EV InSIDER Live—with Loren McDonald of EVAdoption and a high-profile industry stakeholder as a guest. In the webcast, they discuss current pressing issues and hot topics in the rapidly evolving electric vehicle landscape. He earned his master’s degree in international management at the Thunderbird School of Global Management at Arizona State University, Phoenix, Ariz. He also co-authored two books on thermal profiling: Profiling Guide for Profitability and Profiling Guide for Six Sigma.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007eBooks library.
Share on:
Suggested Items
KYZEN to Focus on Aqueous Cleaning and Stencil Cleaning at SMTA Juarez
05/20/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Juarez Expo and Tech Forum, scheduled to take place Thursday, June 5 at the Injectronics Convention Center in Ciudad Jarez, Chihuahua.
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.