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Sunstone and I-007eBooks Launch Book on Designing for Reality
October 24, 2022 | I-Connect007Estimated reading time: 1 minute
I-007eBooks is excited to announce the release of the latest title in its series for designers, The Printed Circuit Designer’s Guide to… Designing for Reality.
This book covers both written and unwritten rules for how to create a realistic, manufacturable design.
Written by topic expert Matt Stevenson of Sunstone Circuits, this book covers the complete circuit board manufacturing process, taking readers on a virtual tour of the printed circuit manufacturing process, from choosing the right CAD tool, to additive/subtractive processes, and even touching on the art of PCB design.
Peer reviewer Duane Benson of Screaming Circuits, says, “I find that having a better understanding of the underlying process helps me create higher quality electronic designs. In this book, Matt Stevenson does a fantastic job of opening the hood and giving the reader that knowledge of the PC board fab process.”
Download your free copy today at I-007eBooks.com/dfr. You can also view our full library at I-007eBooks.com.
Dedicated to educating PCB designers, The Printed Circuit Designer’s Guide to… series of books is a valuable resource for people seeking the most relevant information available.
Look for other exciting titles, like:
- The Evolving PCB NPI Process
- Thermal Management with Insulated Substrates
- Stackups: The Design within the Design
- High Performance Materials
- System Analysis: Electromagnetic Interference and Thermal Analysis of Electronic Systems
- …and more coming this fall
We hope you enjoy The Printed Circuit Designer’s Guide to… Designing for Reality.
For more information, contact:
Barb Hockaday
I-Connect007 eBooks
barb@iconnect007.com
+1-916-365-1727
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 4
09/11/2024 | I-Connect007 Editorial TeamIn this chapter, readers will learn the importance of efficiency in post-SMT processes such as rework and testing. Key KPIs are discussed, along with the need to reduce rework time, improve first-pass yield, maintain testers, and monitor defect rates. By optimizing these processes, manufacturers can enhance product quality, reduce costs associated with defects, and ensure customer satisfaction.
Beyond Design: Integrated Circuit to PCB Integration
09/11/2024 | Barry Olney -- Column: Beyond DesignTechnologies such as artificial intelligence, autonomous cars, smartphones, and wearable devices are significantly transforming the semiconductor industry. The miniaturization trend drives the IC footprint to an even smaller profile, requiring tighter margins. From the PCB designer’s perspective, smaller form factors are achievable, making devices more compact and lightweight. But double-sided SMT placement, reduced routing channels, and high-speed constraints create multiple challenges for designers. However, there are some advantages to miniaturization: shorter interconnects between the IC and the PCB reduce signal loss and electromagnetic interference. High-speed digital signals in the GHz range benefit from reduced parasitics.
Trouble in Your Tank: Things You Can Do for Better Wet Process Control
09/11/2024 | Michael Carano -- Column: Trouble in Your TankFor 40 years, I have been involved in the printed circuit board, circuit board assembly, and semiconductor technology segments, preaching about minimizing defects and improving yields. This is especially true as technology becomes increasingly complex, and additional focus must be placed on yield improvements. Process management and wet process control must be front and center, so it’s quite interesting and timely to talk about wet process control and management for this month’s issue. This theme fits quite well with today's global events. For this industry, the technical curve has steepened dramatically in the past few years.
Sondrel Announces Advanced Modelling Process for AI Chip Designs
09/10/2024 | SondrelSondrel, a leading provider of ultra-complex custom chips for leading global technology brands, has announced an Advanced Modelling Process for AI chip designs.
PCB Workshop and Plant Tour Hosted by the SMTA Wisconsin Chapter
09/09/2024 | SMTAThis half-day course will provide participants with a comprehensive understanding of the multi-layer PCB fabrication process. The workshop will explore how PCB design influences fabrication steps and how the finished product integrates into the assembly process.