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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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Sunstone and I-007eBooks Launch Book on Designing for RealityOctober 27, 2022 | I-Connect007
Estimated reading time: 1 minute
I-007eBooks is excited to announce the release of the latest title in its series for designers, The Printed Circuit Designer’s Guide to… Designing for Reality.
This book covers both written and unwritten rules for how to create a realistic, manufacturable design.
Written by topic expert Matt Stevenson of Sunstone Circuits, this book covers the complete circuit board manufacturing process, taking readers on a virtual tour of the printed circuit manufacturing process, from choosing the right CAD tool, to additive/subtractive processes, and even touching on the art of PCB design.
Peer reviewer Duane Benson of Screaming Circuits, says, “I find that having a better understanding of the underlying process helps me create higher quality electronic designs. In this book, Matt Stevenson does a fantastic job of opening the hood and giving the reader that knowledge of the PC board fab process.”
Dedicated to educating PCB designers, The Printed Circuit Designer’s Guide to… series of books is a valuable resource for people seeking the most relevant information available.
Look for other exciting titles, like:
- The Evolving PCB NPI Process
- Thermal Management with Insulated Substrates
- Stackups: The Design within the Design
- High Performance Materials
- System Analysis: Electromagnetic Interference and Thermal Analysis of Electronic Systems
- …and more coming this fall
We hope you enjoy The Printed Circuit Designer’s Guide to… Designing for Reality.
For more information, contact:
NEC Corporation (NEC; TSE: 6701) has confirmed that its User Plane Function (UPF) for processing user data traffic in 5G core networks (5GC) has achieved an industry-leading throughput of 1.3Tbps per server on Intel servers with 4th generation Intel Xeon Scalable processors.
Cadence’s digital and custom/analog flows are certified on the Intel 18A process technology. Cadence® design IP supports this node from Intel Foundry, and the corresponding process design kits (PDKs) are delivered to accelerate the development of a wide variety of low-power consumer, high-performance computing (HPC), AI and mobile computing designs.
Intel Corp. (INTC) launched Intel Foundry as a more sustainable systems foundry business designed for the AI era and announced an expanded process roadmap designed to establish leadership into the latter part of this decade.
Keysight, Intel Foundry Partner to Certify Electromagnetic Simulation Software for Intel 18A Process Technology02/22/2024 | BUSINESS WIRE
Keysight Technologies, Inc. announces that the RFPro electromagnetic (EM) simulation software, part of the Keysight EDA Advanced Design System (ADS) integrated tool suite, is now certified by Intel Foundry for design engineers targeting Intel 18A process technology.
Uyemura has announced an important field promotion, and a new addition to its Connecticut Tech Center Engineering Team. Both actions are in support of the company’s increasing focus on IC substrates, and its role as a supplier to wafer manufacturers, semiconductor fabs and PWB customers.