-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Sunstone and I-007eBooks Launch Book on Designing for Reality
October 27, 2022 | I-Connect007Estimated reading time: 1 minute

I-007eBooks is excited to announce the release of the latest title in its series for designers, The Printed Circuit Designer’s Guide to… Designing for Reality.
This book covers both written and unwritten rules for how to create a realistic, manufacturable design.
Written by topic expert Matt Stevenson of Sunstone Circuits, this book covers the complete circuit board manufacturing process, taking readers on a virtual tour of the printed circuit manufacturing process, from choosing the right CAD tool, to additive/subtractive processes, and even touching on the art of PCB design.
Peer reviewer Duane Benson of Screaming Circuits, says, “I find that having a better understanding of the underlying process helps me create higher quality electronic designs. In this book, Matt Stevenson does a fantastic job of opening the hood and giving the reader that knowledge of the PC board fab process.”
Download your free copy today at I-007eBooks.com/dfr. You can also view our full library at I-007eBooks.com.
Dedicated to educating PCB designers, The Printed Circuit Designer’s Guide to… series of books is a valuable resource for people seeking the most relevant information available.
Look for other exciting titles, like:
- The Evolving PCB NPI Process
- Thermal Management with Insulated Substrates
- Stackups: The Design within the Design
- High Performance Materials
- System Analysis: Electromagnetic Interference and Thermal Analysis of Electronic Systems
- …and more coming this fall
We hope you enjoy The Printed Circuit Designer’s Guide to… Designing for Reality.
For more information, contact:
Barb Hockaday
I-Connect007 eBooks
barb@iconnect007.com
+1-916-365-1727
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Alternative Manufacturing, Inc. (AMI) Announces Commitment to Excellence in Industrial, Defense, Aerospace, Renewables, and Robotics Markets
09/16/2025 | Alternative Manufacturing, Inc.Alternative Manufacturing, Inc. (AMI), a 100% employee-owned contract manufacturer, proudly reaffirms its leadership in the electronics manufacturing services (EMS) industry with a continued commitment to delivering high-quality PCBAs and box builds across the industrial, defense, aerospace, renewable energy, and robotics markets.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
Integrating Uniplate PLBCu6 With the Digital Factory Suite
09/12/2025 | Giovanni Obino and Andreas Schatz, MKS' AtotechPrinted circuit board manufacturing is rapidly changing, driven by miniaturization, stringent reliability requirements, and growing pressure for sustainable production. Meeting these challenges requires more than incremental improvements; it demands a combination of precise equipment and real-time process intelligence. The pairing of Uniplate® PLBCu6 with the Digital Factory Suite (DFS) demonstrates how hardware and software can work together to create more responsive, resource-efficient manufacturing.