-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Teledyne to Acquire ETM-Electromatic
October 26, 2022 | Business WireEstimated reading time: 1 minute
Teledyne Technologies Incorporated announced that a wholly-owned subsidiary has entered into an agreement to acquire ETM-Electromatic, Inc. (ETM). ETM, headquartered in Newark, California, designs and manufactures high-power microwave and high-energy X-ray subsystems for cancer radiotherapy, defense and X-ray security applications. Teledyne will also acquire ETM’s purpose-built manufacturing facility from an affiliate of ETM and its owners. Terms of the transactions were not disclosed.
Founded in 1973, ETM possesses a long pedigree and scarce combination of high-voltage, microwave combining, thermal engineering and X-ray system integration capabilities. For decades, ETM has provided high-power amplifier subsystems for radar, electronic countermeasures and satellite communications. More recently, ETM has developed subsystems and complete high-energy X-ray generation systems for cancer radiotherapy and security screening.
“ETM is uniquely complementary to our healthcare imaging and defense electronics businesses,” said Robert Mehrabian, Chairman, President and Chief Executive Officer. “For many years, Teledyne MEC and Teledyne e2v have supplied critical vacuum electron device components to ETM. The combination with ETM will now accelerate Teledyne’s ability to provide greater content and subsystem-level solutions to cancer radiotherapy, defense and security customers. In addition, ETM strengthens our capabilities in microwave combining technologies and high-power gallium nitride (GaN) based solid state power amplifiers.”
Suggested Items
L3Harris Equips New German H145M Helicopters with High-Performance Imaging Capabilities
12/10/2024 | L3Harris TechnologiesL3Harris Technologies is providing WESCAM MX™-15D electro-optical/infrared sensor systems to Airbus Helicopters for the German armed forces and its new fleet of multi-role H145M helicopters.
QinetiQ US Awarded $42M Task Order to Support U.S. Army Advanced Sensor Processing and Imaging Technologies
12/02/2024 | QinetiQQinetiQ US has been awarded a four-year, $42 million task order to support the U.S. Army Combat Capabilities Development Command (DEVCOM) C5ISR Center's Research & Technology Integration (RTI) Directorate.
Teledyne's Detector Enables NASA's Europa Clipper MISE Instrument
10/21/2024 | TeledyneTeledyne Technologies Incorporated is pleased to announce its contribution to NASA's successful Europa Clipper launch, which took place at NASA's Kennedy Space Center.
Connect the Dots: Designing for Reality—Outer Layer Imaging
09/26/2024 | Matt Stevenson -- Column: Connect the DotsWelcome to the next step in the manufacturing process—the one that gets the chemical engineer in all of us excited. I am referring to outer layer imaging, or how we convert digital designs to physical products. On a recent episode of I-Connect007’s On the Line with… podcast, we explained how the outer layer imaging process maps the design’s unique features onto the board.
Omni Design Technologies Partners with Aura Intelligent Systems on Next Generation Radar
09/16/2024 | BUSINESS WIREOmni Design Technologies, a leading provider of high-performance, low-power data acquisition and signal-processing solutions, and Aura Intelligent Systems, a developer of high-resolution imaging radar for ADAS and autonomous vehicles, announced a partnership on Aura’s next generation digital radar development.