Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
November 4, 2022 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
We’re officially in show season and Managing Editor Nolan Johnson just got back from SMTA International. As he says in his review, the show drew a sizeable crowd this year. With the pandemic in the rear-view window, let’s hope our trade shows are getting back to normal.
This week, we have articles about everything from the first flexible circuit patent to the CHIPS Act, a growing PCB broker, and a look at whether manufacturers believe that we’re in a recession or not (Hint: We are officially in a recession.).
Check back for more show coverage.
Flexible Thinking: The Chameleon of Interconnection Technologies
Published November 3
In this column, Joe Fjelstad discusses the earliest flexible circuit patent, which dates to 1903. The patent for “Improvements in, or Connected with, Electric Cables and the Joining of Same” was originally designed for the new telephone industry, but as Joe explains, flex is quite a chameleon.
American Made Advocacy: The CHIPS Act is Just the Beginning
Published November 3
As Travis Kelly explains in this column, the CHIPS and Science Act is really just the first step of a long marathon. The U.S. now only manufactures 4% of the PCBs in the world, down from 30% a few decades ago, and that number will continue to head further south unless we take some definite action, and now.
SMTAI: Like a Tesla in a Drag Race
Published November 3
Nolan Johnson spent the last few days at SMTA International, back for its second year in Minneapolis. Now that the pandemic is over, SMTAI is back, and as Nolan, reports, even the weather cooperated. If you couldn’t make it to the show, check out our video coverage of SMTAI on our Real Time with… SMTAI site.
IPC: One-Fourth of Electronics Manufacturers Believe We are in a Recession
Published November 1
It doesn’t feel like a recession. But it’s not exactly a state secret that we are in a recession, which is officially defined as two back-to-back quarters of negative GDP. We’ve had that, but as one company owner told me recently, “If this is a recession, I’ll take it.”
Millennium Circuits on The Move
Published October 31
I recently met with Daniel Thau, CEO and founder of PCB broker Millennium Circuits. In this interview, Daniel gives us the background on this company that founded at the tender age of 21, and the company’s focus on providing complex PCBs very quickly.
Share on:
Suggested Items
Real Time with... IPC APEX EXPO 2025: Improving the Electronics Industry With Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPODevan Iyer, the Chief Strategist for Advanced Packaging at IPC, shares insights from his recent presentation at the EMS Leadership Summit. The discussion covers the importance of understanding market segments in IoT, power electronics, and high-performance computing. EMS companies are encouraged to specialize, invest wisely, and collaborate to meet customer needs.
Real Time with... IPC APEX EXPO 2025: The Role of AI in Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPOIn a follow-up to his keynote, Dr. Ahmad Bahai, discusses the critical intersection of advanced packaging, computing, and AI in semiconductor innovation with Nolan Johnson and Devan Iyer. He emphasizes the need for new approaches to handle the data economy and highlights AI's role in optimizing electronics manufacturing. The conversation covers challenges in power and thermal management, the impact of AI on EDA tools, and bio-inspired innovations. Predictions about future trends point towards increased efficiency in design and manufacturing.
New IPC Standard Sets First Global Benchmark for E-Textile Wearable Reliability
04/29/2025 | IPCIPC announces the release of IPC-8981, Quality and Reliability of E-Textile Wearables. This first-of-its-kind standard sets baselines for testing and classifying e-textile wearables, addressing key challenges in product reliability, performance, and quality assurance.
Choosing the Right Strategic Path
04/29/2025 | Marcy LaRont, PCB007 MagazineTom Yang, CEO of CEE PCB, discusses the current economic challenges, noting reduced purchasing power post-pandemic. He highlights the growing demand for HDI in consumer electronics due to AI growth. Tom also expresses concerns about tariffs under the new U.S. administration, prompting CEE to diversify production locations, including new plants in Southeast Asia. He emphasizes the need for PCB manufacturers to adapt strategically amidst rising costs and fierce competition, particularly for mid-sized shops facing unique challenges in the industry.
Rising Star Award: Paavo Niskala, TactoTek
04/28/2025 | Nolan Johnson, I-Connect007Paavo Niskala joined the IPC community in 2022 as part of the inaugural steering group for in-mold electronics. He led the development of standard IPC-8401, Guidelines for In-Mold Electronics, chairing the project from its inception to its publication in 2024. Currently, Paavo serves as vice chair of the D-84A Plastronics Accelerated Reliability Testing Task Group, contributing his expertise to advancing reliability standards in the field.