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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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EMA Design Automation Announces New Support+ Program for Cadence CustomersNovember 9, 2022 | EMA Design Automation
Estimated reading time: 1 minute
EMA Design Automation, a full-service provider and innovator of Electronic Design Automation (EDA) systems solutions, is pleased to announce the launch of the EMA Support+ program. This new benefit is available to all EMA customers on active maintenance and includes unique offers and tools to help engineers get the most from their Cadence design software. The program includes:
- Access to EMA's new Knowledgebase with solutions, tips, and guides
- Discounted access to EMA E-learning with over 100 hours of training
- The EMA Toolkit featuring integrated apps to improve efficiency
“EMA has been delivering world class EDA support for over 30 years,” said Manny Marcano, President and CEO of EMA Design Automation. “We are very excited to be able to offer this benefit as another example of the unique value EMA brings to the engineering community worldwide.”
Featured within the EMA Support+ program is the EMA Toolkit; a collection of apps designed to improve user productivity and help designers get their boards done right the first time. Version 1.0 of EMA Toolkit consists of 5 apps:
- Find in Design - Quickly scan multiple designs to find where specific components are used
- CircuitFit - Calculate and analyze board space occupied by components before committing to layout
- PCB Clustering - Advanced PCB placement and clustering for faster more efficient layout
- Highlight Part by Property - Automatically color-code parts by properties for easy identification
- CIS BOM Template - Easily generate a fully formatted and branded BOM from CaptureCIS
“We are just getting started,” said Manny Marcano. “The team has great plans ahead for this program to keep adding value for our customers.”
One of my great joys as a grandfather of eight is spending time with them at the park. It doesn't take too long until I'm getting stuck on a slide that is too small for me or on the seesaw, with me on one side and them trying to lift me. At that point, they learn some harsh lessons in physics and how heavy Grandpa really is. A seesaw is a relatively simple device, but it’s a great way to explain a rather complex concept in PCB design: design tradeoffs. Each decision made throughout a design comes with inherent pros and cons.
Spirit AeroSystems, Inc. announced the grand opening of its Engineering Design Center in Subang, Malaysia, that expands the company’s global engineering capabilities, during opening day of the 2024 Singapore Air Show.
It’s been another busy week in the industry. We lost another old friend last week. The EIPC show happened, and Pete Starkey provided us with complete and compelling show coverage, from start to finish. Recently, we posed the question, “When is it time to introduce embedded components into your PCB design?” which was asked and answered by design aficionado Kris Moyers in the latest issue of Design007 Magazine. We are proud to be a part of the exciting Global Insights weekly newsletter, which Nolan Johnson and Brian Knier explored in their interview, and we rounded out the week with some big merger news. Here are my picks for the past week’s must-read news items.
ROCKA Solutions is pleased to announce its partnership with Vega Industries, Inc., a manufacturer of premium-quality driver bits and fastener driving tools. Under this collaboration, ROCKA Solutions is a distributor for Vega Industries' top-notch tools designed for precision and durability.
Aismalibar will be attending the APEC, the leading conference for practicing power electronics professionals, in Long Beach, California from February 25th to 29th, 2024 in Booth 552. Aismalibar will be presenting new cooling technologies for power electronics, specifically Thermal Interface Materials (TIMs) and Insulated Metal Substrates (IMS).