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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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Avishtech Introduces Gauss Sustainability OfferingNovember 15, 2022 | Avishtech, Inc.
Estimated reading time: 1 minute
Avishtech, a leading provider of PCB simulation solutions, announced the launch of its Gauss Sustainability offering. With this offering, users can assess design-specific CO2-equivalent emissions for their printed circuit board designs. This assessment includes the full set of raw materials as well as all process steps and yield losses. In addition, Gauss Sustainability will enable the companies who are now working to standards like the Greenhouse Gas Protocol, ISO14404, ISO14064 (both -1 and -2), and ISO 14067, or are in the process of adopting carbon emissions reduction initiatives as part of their overall corporate strategy, to conduct Life-Cycle Analysis and Life-Cycle Impact Analysis.
Keshav Amla, Founder and CEO of Avishtech notes, “The overall impact of Greenhouse Gases on the environment, the future of the world going forward and the steps needed to mitigate them have been understood for some time now. With Gauss Sustainability, we are offering our customers a comprehensive and easy-to-use methodology that will take the key PCB factors into account, in the form of a Cradle-to-Gate Life Cycle Analysis. For any companies that have set carbon emissions reduction goals, signed onto pledges, or simply wish to get ahead of forthcoming regulations and standards, Gauss Sustainability will help them assess the impacts of key design choices and thereby help work to reduce emissions as a part of the design process.”
Siemens Joins Semiconductor Education Alliance to Address Skills and Talent Shortage in Global Semiconductor Industry02/29/2024 | Siemens Digital Industries
Siemens Digital Industries Software announced today it has joined the Semiconductor Education Alliance to help build and nurture thriving communities of practice across the integrated circuit (IC) design and Electronic Design Automation (EDA) industries, from teachers and schools to universities, publishers, educational technology companies and research organizations.
At DesignCon, the I-Connect007 Editorial Team met with Brad Griffin, product marketing group director for the System Analysis Group at Cadence Design Systems. Brad explains how this analysis tool enables designers to address SI and PI issues early in the design process, before they become costly errors, and why he believes his late co-worker Dennis Nagel would be proud to see his efforts come to fruition.
Sondrel, a leading provider of ultra-complex chips for leading global technology brands, announces that it has secured two new contracts to supply Design Consultancy Services for a Network processor chip and a Radio Transceiver chip.
With the seemingly endless ways that electronic products are worming their way into our lives, what was once “nice to own” is increasingly considered indispensable. The capabilities of these products have been driven by relentless improvements at every level of the manufacturing chain, from individual transistors (which are approaching Angstrom levels) to systems the size of buildings supporting Bitcoin mining and increasingly distributed AI products.
Indium Corporation to Showcase Proven EV Products and High-Reliability Alloys at Productronica China02/28/2024 | Indium Corporation
As a materials pioneer and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 20-22, in Shanghai.