Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
An Opportunity to Give Thanks
November 24, 2022 | Andy Shaughnessy, PCB Design007Estimated reading time: 1 minute
It’s been a good, busy, and interesting year for all of us, and I know we’re all ready to visit with our families and carve a giant turkey today. I think we’ve all earned a little down time, don’t you agree?
In the spirit of gratitude, we wanted to take this opportunity to offer thanks. First, thank you to our readers for making us a regular part of your workday. When you get right down to it, we work for you, and we appreciate your support. Next, let’s give our columnists and contributors a round of applause—we couldn’t do it without them. They’re truly the best and the brightest in the industry. Each month they provide you with the most cutting-edge technologies and practices, and our pages are better for it. A heartfelt thank you to our contributors.
Finally, let’s hear it for our advertisers. Many of these companies have worked with us for over a decade, sharing their products, services, and technologies. It’s mutual support and we couldn’t do this without them. So, to all our customers, thank you for your support and understanding that your messages in I-Connect007 truly are good for the industry.
From I-Connect007, have a Happy Thanksgiving!
Share on:
Suggested Items
AI Chips for the Data Center and Cloud Market Will Exceed US$400 Billion by 2030
05/09/2025 | IDTechExBy 2030, the new report "AI Chips for Data Centers and Cloud 2025-2035: Technologies, Market, Forecasts" from market intelligence firm IDTechEx forecasts that the deployment of AI data centers, commercialization of AI, and the increasing performance requirements from large AI models will perpetuate the already soaring market size of AI chips to over US$400 billion.
Koh Young Invites You to the 2025 IEEE Electronic Components and Technology Conference
05/06/2025 | Koh YoungKoh Young, the industry leader in True3D™ measurement-based inspection solutions, invites you to join us at the 2025 IEEE Electronic Components and Technology Conference (ECTC), taking place May 27–30, 2025, at the Gaylord Texan Resort & Convention Center in Grapevine, Texas
SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics
05/01/2025 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden.
Elephantech, Logitech Together Drive Disruptive Electronics Innovation
05/01/2025 | ElephantechElephantech Inc. announced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the printed circuit board (PCB) industry.
Microsoft’s Brad Smith Urges U.S. Leadership in Quantum Technology
04/29/2025 | I-Connect007 Editorial TeamIn a blog post published on April 28, 2025, Brad Smith, Vice Chair and President of Microsoft, underscores the critical need for the United States to accelerate investment in quantum technology. While public focus remains fixed on artificial intelligence, Smith argues that quantum computing is an equally vital frontier with the power to revolutionize industries and solve complex global challenges across science, medicine, energy, and agriculture.