-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on North America
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Nordson Electronics Solutions Introduces New SELECT Synchro Selective Soldering System
December 1, 2022 | Nordson Electronics SolutionsEstimated reading time: 2 minutes
Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, introduces the new SELECT Synchro™ selective soldering system for high-volume printed circuit board assembly applications. The SELECT Synchro is a multi-station selective soldering system (patent pending) that uses a unique, synchronous motion to increase throughput, improve cost-of-ownership, and provide flexibility for electronics manufacturers.
The innovative SELECT Synchro system can replace existing selective soldering operations to improve yield and save space for many through-hole and SMT mixed-technology soldering applications. Furthermore, the Synchro system can help electronics manufacturers to step away from wave soldering with its faster, flexible, and efficient operations, compared to typical selective soldering solutions.
Key benefits of SELECT Synchro:
- Increased Throughput – Eliminates board conveyance time by as much as 25% while delivering outstanding solder joint reliability, boosting throughput 20-40% for most applications.
- Improved Cost-of-Ownership – The space-efficient system is as much as 4X shorter than typical selective soldering equipment, resulting in 60% reduction in footprint.
- Smart – Automatically balances the process to broaden flux and soldering flexibility, increasing throughput while providing traceability.
- Flexible – Configured with five solder pots to match manufacturing needs for different alloys, and different or singular nozzles. Handles long boards up to 460mm wide and 2500mm long in the standard model and boards up to 680 x 2500mm in the Synchro XL model.
- Enhanced Quality – Improved process controls are available for closed-loop wave height check and automatic adjustment, fluxing process controls, process camera for viewing nozzles, and board warpage control.
How it works: Inside the innovative SELECT Synchro system, a board is pulled at a constant speed through the fluxing, pre-heating, and soldering process steps. The flux and solder applicators are programmed to follow and treat boards as they travel through the equipment to deliver synchronous-motion selective soldering. Multiple solder pots and different nozzle sizes are available to provide flexibility with solder quantities, solder alloys, and board designs.
“People are amazed by the technology of synchronous soldering. By moving the target board as well as the flux and soldering applicators, the operations are sped up, and the system is reduced in size," explained Florian Strohmayer, product line manager, Nordson Electronics Solutions. "In terms of throughput, the SELECT Synchro concept can replace wave soldering equipment while increasing the soldering quality and reducing the cost of ownership.”
The unique design inside the SELECT Synchro system increases throughput by reducing the time spent conveying boards as much as 25%. Multiple solder pots can be configured, and the system balances the whole process for efficiency and flexibility to deliver superior solder joint reliability. In addition, the machine’s size can be as much as four times shorter than a typical selective soldering system, for example, shrinking in length from 10 to 2.5 meters. Cost-of-ownership is improved while still accommodating long boards as large as 680 x 2500 mm.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
05/07/2026 | Matt Stevenson -- Column: Connect the DotsWhen designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.