Dan’s Biz Bookshelf: ‘The Next RenAIssance: AI and the Expansion of Human Potential’
The Chemical Connection: When the Industry Moves Faster Than the Standards
Driving Innovation: Selecting the Right Laser Source
iNEMI Call for Participation: Hybrid PCBs for Next Generation Applications
December 1, 2022 | iNEMIEstimated reading time: 1 minute
An increasing range of high-speed applications require low loss dielectric laminate materials within a printed circuit board (PCB) stack-up to achieve the required electrical performance. However, these materials are more expensive than standard loss materials. One solution to minimize cost is to selectively use lower loss material on only the layers that require higher performance and use cheaper material on layers that do not require high performance. This “hybrid” combination of laminate materials can provide the required electrical performance at minimum cost, but the combination of dissimilar dielectric materials has associated challenges for PCB fabrication that can negatively impact reliability if manufacturing processes are not optimized and/or the materials are in some way incompatible.
According to an iNEMI survey, determining material compatibility and minimizing warpage are among the greatest challenges in hybrid PCB manufacturing. iNEMI’s Hybrid PCBs for Next Generation Applications project, led by Sarah Czaplewski (IBM) and Steven Ethridge (Dell), will evaluate how placement of dielectric materials with dissimilar properties within a hybrid stack-up impacts PCB thermomechanical performance. The team will study the impact of the following parameters on via hole reliability and PCB warpage:
- Material placement within a symmetrical hybrid stack-up with materials having different properties such as CTE and/or gel point
- Various ratios of dissimilar dielectric materials in a symmetrical hybrid stack-up (i.e., 25% material A & 75% material B; 50% material A & 50% material B, etc.)
- Resin asymmetry in the stack-up
The results of this project will increase understanding of how hybrid stack-up designs influence PCB thermomechanical performance. OEMs and PCB manufacturers may use this information to improve stack-up designs to be more robust and reliable as well as reduce the number of design and test iterations, thereby saving cost and development time. Laminate manufacturers may use this information to help tailor resin systems for use in hybrid constructions to better support customer needs.
Registration
This webinar is open to industry; advance registration is required.
Wednesday, December 7, 2022
12:00-1:00 p.m. EST (US)
9:00-10:00 a.m. PST (US)
6:00-7:00 p.m. CET (Europe)
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Ventec Evaluates US Manufacturing Facility to Support North American Growth
04/28/2026 | Ventec International GroupVentec International Group today announced that it is evaluating the potential establishment of a manufacturing facility in the United States to support its growing North American customer base with high-performance laminate and prepreg materials.
Roundtable: Advanced Materials
04/27/2026 | I-Connect007 Editorial TeamDriven largely by the need for advanced chip technology for super compute ability and AI applications, low Dk, low-loss resin systems, and heavy copper laminate are attracting significant attention and global resources. There are numerous unavoidable challenges in this market that will impact manufacturers and the supply chain, and they may be hitting critical mass sooner than OEMs and fabricators think. In this roundtable discussion, moderator Marcy LaRont speaks with topic experts: Mark Goodwin, John Fix, and Ed Kelley.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Volatile Metals Market Creates PCB Pricing Headache
04/20/2026 | Nolan Johnson, I-Connect007Market volatility for precious metals is very real. Financial organizations have reported elevated volatility, with record highs and steep corrections; in 2025 alone, gold has increased by over 60%, silver over 120%, and copper over 35%. Each is a critical raw material used in electronics manufacturing, where pricing is already fraught for business owners and their customers due to tariff uncertainty and a critical supply chain that resides mostly in China. The volatility of precious metals markets adds yet another layer of complexity for manufacturers, pushing up raw material costs.
I-Connect007 Releases Episode 4 of ‘PCB Materials: The Backbone and Future of Electronics’ Podcast Series
04/09/2026 | I-Connect007I-Connect007 is excited to announce the release of Episode 4 in its six-part podcast series with Isola experts, PCB Materials: The Backbone and Future of Electronics. Titled “Reliability Under Pressure—PCBs in Harsh Environments,” this episode explores the challenges of maintaining long-term performance in demanding applications like aerospace, automotive, and defense. Host Marcy LaRont speaks with Laura Martin, director of strategic markets at Isola, about what reliability truly means when printed circuit boards are pushed to their limits.