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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
December 2, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
Normally, the holiday season is a slow(ish) news time, but this year just feels different. My opinion is that the technology industry banked up a whole bunch of innovations and new products during the pandemic disruptions, which are coming to market as quickly as possible. The November/December news is full of technology discussion, as my selections this week clearly demonstrate.
We have a discussion on additively manufactured electronics, as well as a high-level look at fabrication for the UHDI market—both emerging markets. I also noticed that our readers were quite interested in industry reports on U.S. semiconductor industry challenges, and a forward look at the drivers in the flexible PCB fabrication market, so I was sure to include the links again. Finally, I thought I’d share the news item about a new missile guidance system prototype test that caught reader attention and which has garnered quite a bit of attention.
3D Electronic Devices With Additive Manufacturing
Published November 29
In the news on Dec. 1, Nano Dimension issued a press release announcing Q3 2022 results where the company shares that it is on track to increase revenue by 10X over 2020’s results. That news shines a spotlight on this article from Shavi Spinzi discussing the possibilities of additively manufactured electronics.
Global Flexible PCB Market Report 2022: Rising Use in the Aerospace and Aviation Sector Boosts Growth
Published November 25
My recent conversations with flex manufacturers all have a familiar tone: “We’re really busy, capacity is maxed out.” Well, this quote from the Flexible PCB Marketplace Report news release corroborates what I’m hearing: “The [flex] market is expected to surge in the coming years due to the rising use of flexible printed circuit boards in consumer electronics, especially smartphones, laptops, displays, and other electronic devices. According to official industrial sources, around 1.5 billion smartphones were sold in the year 2019.” The article discusses automotive, aviation and aerospace.
Understanding the UHDI Market
Published November 28
This interview with Meredith LaBeau and Todd Brassard from Calumet Electronics included this in the setup to the conversation, “The more we investigate UHDI in the current market, the more advanced packaging becomes a part of the conversation. The two emerging technologies lean on each other for their overall success. UHDI is the method by which state-of-the-art advanced packaging will be fabricated; substrates are creating a market for UHDI capabilities.” In many ways, Calumet is blazing the trail for nimble PCB fabricators to move forward into capabilities that support advanced packaging. Clearly, readers were interested this week in what LaBeau and Brassard had to say.
New Report Identifies Challenges to Continued U.S. Leadership in Semiconductor Design, Innovation
Published November 30
This report from the Semiconductor Industry Association (with Boston Consulting Group) identifies three key areas the U.S. must address in the administration of the CHIPS Act in order to maintain a leadership position: Design and R&D investment needs are on the rise, there is a shortage of domestic design talent, and open access to global markets is under pressure. Take a read and see if you agree.
PAC-3 Intercepts Target In Successful Test of Lockheed Martin Remote Interceptor Guidance
Published November 25
Lockheed Martin announced that their new missile communication device connected with a U.S. Army PAC-3 missile in flight. This prototype system is seen as a step forward in missile guidance systems.
Suggested Items
SPEA Expands in Southeast Asia with New Subsidiary in Thailand
05/17/2024 | SPEASPEA, a global leader in automatic test equipment for the manufacturing of semiconductor, microelectronic and electronic devices, today announced the opening of its new subsidiary in Thailand. This expansion marks a significant step forward in SPEA's commitment to serving the growing Southeast Asian microchip and electronics market with leading-edge manufacturing machinery and equipment.
Indium Corporation to Showcase Sustainable Solutions for Power Electronics at PCIM
05/17/2024 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation® will proudly showcase a selection of innovative products at PCIM Europe, June 11-13, in Nuremberg, Germany.
Siemens, Foxconn Team Up to Optimize Forward-thinking Manufacturing
05/16/2024 | FoxconnSiemens AG, a leading technology company, and Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer, have signed a memorandum of understanding (MoU) to drive digital transformation and sustainability in smart manufacturing platforms.
IPC Releases May 2024 Global Sentiment of the Electronics Supply Chain Report
05/16/2024 | IPCSentiment among electronics manufacturers fell this month, after hitting a new high in April. Despite the decline, sentiment remains historically high according to IPC’s May Sentiment of the Global Electronics Manufacturing Supply Chain Report.
Sypris Reports Q1 2024 Results; Revenue Up 10%
05/15/2024 | Sypris Solutions Inc.The Company’s first quarter 2024 consolidated revenue increased 10.1% to $35.6 million compared with the prior-year quarter, representing the 11th quarter of double-digit year-over-year growth during the past 12 quarterly periods.