-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Electronics vs. Physics: Why Vias Don’t Get Hot
December 6, 2022 | Douglas Brooks, Consultant, and Johannes Adam, ADAM ResearchEstimated reading time: 1 minute

Most of are aware that when we pass an electrical current through a trace (conductor), the trace will heat up. This temperature increase is caused by the I2R power loss dissipated in the resistance of the trace. The resistance of a copper trace is mostly determined by its geometry (cross-sectional area), and there are lots of studies trying to look at the relationship between the current down a trace (of known size) and the resulting temperature of the trace.
But the situation is much more complicated than this. There are physical properties that exist that result in helping to cool the trace. These properties are usually a combination of conduction of the heat away from the trace through the material, convection of the heat away from the trace through the air, and radiation of the heat away from the trace. A stable temperature is reached when the I2R heating equals the cooling—i.e., when the electronic and physical properties are balanced.
We have spent several (enjoyable) years collaborating on these effects. Douglas is an electrical engineer and understands electronics. Johannes is a thermodynamics physicist, and understands heat transfer. Between us we learned a lot about the thermal characteristics of vias.
Vias Don’t Get Very Hot
Traces heat because of the current through their resistance, resulting in I2R power losses. This temperature increase is caused by what we call “Joule heating”:
Joule heating is the physical effect by which the pass(age) of current through an electrical conductor produces thermal energy. This thermal energy is then evidenced through a rise in the conductor material temperature, thus the term “heating.” One can see Joule heating as a transformation between “electrical energy” and “thermal energy,” following the energy conservation principle.
We are all aware that, in general, for a given trace an increase in current through the trace will correspond to an increase in temperature of the trace. When it comes to vias, the industry guidelines have generally been to size the cross-sectional area of a via to equal that of its parent trace. Then the via will be the same temperature as the trace.
To read this entire article, which appeared in the November 2022 issue of Design007 Magazine, click here.
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.